IEEE Intersociety Thermal and Thermomechanical Conference

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IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Best Paper Awards

ITherm 2018


COMPONENT-LEVEL THERMAL MANAGEMENT

Best Paper

  • Joel D. Chapman, Peter A. Kottke, Andrei G. Fedorov "Nanoelectrosprayed Liquid Jets for Evaporative Heat Transfer Enhancement."

Outstanding Paper

  • Thomas Germain, Tanvir A. Chowdhury, Jake Carter, and Shawn A. Putnam. "Measuring Heat Transfer Coefficients for Microchannel Jet Impingement Using Time-domain Thermoreflectance."

SYSTEM-LEVEL THERMAL MANAGEMENT

Best Paper

  • Ying-Ju Yu and Carole-Jean Wu "Designing a Temperature Model to Understand the Thermal Challenges of Portable Computing Platforms."

Outstanding Paper

  • James W. VanGilder, Christopher M. Healey, Michael Condor, Wei Tian, and Quentin Menusier "A Compact Cooling-System Model for Transient Data Center Simulations."

MECHANICS & RELIABILITY

Best Paper

  • Bernhard Wunderle, Daniel May, Jens Heilmann, Joerg Arnold, Josef Hirscheider, Y. Li, Joerg Bauer, Mohamad Abo Ras "A Novel Concept for Accelerated Stress Testing of Thermal Greases and In-situ Observation of Thermal Contact Degradation."

Outstanding Paper

  • Pradeep Lall, Yihua Luo, Luu Nguyen "A Novel Numerical Multiphysics Framework for the Modeling of Cu-Al Wire Bond Corrosion under HAST Conditions."

EMERGING TECHNOLOGIES & FUNDAMENTALS

Best Paper

  • Quang N. Pham, Shiwei Zhang, Lin Cheng-Hui, Shuai Hao, and Yoonjin Won "Boiling Heat Transfer Performance of Three-dimensionally Ordered Microporous Copper with Modulated Pore Diameters"

Outstanding Paper

  • David B. Brown, Xufan Li, Kai Xiao, David B. Geohegan, Satish Kumar "Thermal Boundary Conductance Mapping at Metal-MoSe2 Interface."

ITherm 2017


COMPONENT-LEVEL THERMAL MANAGEMENT

Best Paper

  • Sircar, J. D., D. F. Hanks, Z. Lu, T. Salamon, K. R. Bagnall, S. Narayanan, D. Antao, B. Barabadi, and E. N. Wang. "High Heat Flux Evaporation from Nanoporous Silicon Membranes." https://doi.org/10.1109/ITHERM.2017.7992516

Outstanding Paper

  • Parida, P. R., A. Sridhar, A. Vega, M. D. Schultz, M. Gaynes, O. Ozsun, G. McVicker, T. Brunschwiler, A. Buyuktosunoglu, and T. Chainer. "Thermal Model for Embedded Two-Phase Liquid Cooled Microprocessor." https://doi.org/10.1109/ITHERM.2017.7992508

SYSTEM-LEVEL THERMAL MANAGEMENT

Best Paper

Outstanding Paper


MECHANICS & RELIABILITY

Best Paper

Outstanding Paper

  • Dudek, R., R. Döring, A. Otto, S. Rzepka, S. Stegmeier, S. Kiefl, A. Lunding, and R. Eisele. "FE Analyses and Power Cycling Tests on the Thermo-Mechanical Performance of Silver Sintered Power Semiconductors with Different Interconnection Technologies." https://doi.org/10.1109/ITHERM.2017.7992618

EMERGING TECHNOLOGIES & FUNDAMENTALS

Best Paper

Outstanding Paper


ITherm 2016


THERMAL MANAGEMENT

Best Paper

  • Brunschwiler, T., J. Zürcher, S. Zimmermann, B. R. Burg, G. Schlottig, Xi Chen, T. Sinha, et al. "Review of Percolating and Neck-Based Underfills with Thermal Conductivities up to 3 W/m-K." https://doi.org/10.1109/ITHERM.2016.7517541

Outstanding Paper


MECHANICS & RELIABILITY

Best Paper

Outstanding Paper


EMERGING TECHNOLOGIES & FUNDAMENTALS

Best Paper

  • Drummond, K. P., J. A. Weibel, S. V. Garimella, D. Back, D. B. Janes, M. D. Sinanis, and D. Peroulis. "Evaporative Intrachip Hotspot Cooling with a Hierarchical Manifold Microchannel Heat Sink Array." https://doi.org/10.1109/ITHERM.2016.7517565

Outstanding Paper

  • Chang, J. Y., T. Harirchian, S. Sahasrabudhe, S. Klein, F. Liang, Haowen Liu, M. Weng, et al. "Thermal-Mechanical Considerations during Thermal Solution Assembly of Bare-Die Packages." https://doi.org/10.1109/ITHERM.2016.7517536

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