IEEE Intersociety Thermal and Thermomechanical Conference


IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems



Coordinators: Bill Chen ()ASE); Bill Bottoms (Fluence Analytics, Inc.)

All ITherm attendees are invited to attend the Heterogeneous Integration Roadmap (HIR) all-day workshop. This workshop is an important working session for our profession and for our industry, and attendance is complimentary and open to all ITherm and ECTC attendees. Heterogeneous Integration refers to the integration of separately manufactured components into a higher level assembly (SiP) that, in the aggregate, provides enhanced functionality and improved operating characteristics. In this definition components should be taken to mean any unit whether individual die, MEMS device, passive component and assembled package or sub-system that are integrated into a single package. The operating characteristics should also be taken in its broadest meaning including characteristics such as system level performance and cost of ownership. Our Industry has reinvented itself through multiple disruptive changes in technologies, products and markets. With migration of logic, memory and applications to the Cloud, AI at the Edge, the Internet of Things (IoT) to internet of everything (IOE), smart devices everywhere, and autonomous automotive; the pace of innovation is increasing to meet these challenges. The mission of this Heterogeneous Integration Roadmap is to provide guidance to the profession, industry, academia and government to identify key technical challenges with sufficient lead time that they do not become roadblocks preventing the continued progress in electronics. That progress is essential to the future growth of the industry and the realization of the promise of continued positive impact on mankind. The approach is to identify the requirements for heterogeneous integration in the electronics industry through 2031, determine the difficult challenges that must be overcome to meet these requirements and, where possible, identify potential solutions. The Heterogeneous Integration Technology Roadmap is sponsored by the IEEE EPS Society, IEEE Electron Devices Society (EDS), and IEEE Photonics Society, together with SEMI and ASME EPPD.

For more information, please visit:

Bill Chen

Bill Chen
Bill Bottoms

Bill Bottoms

Heterogeneous Integration Roadmap Workshop at ECTC


May 29th 2018 (Tuesday)

8:00 am to 8:30 am Conference Room 1

Workshop Opening

  • HIR Introduction & Roadmaps Collaboration
  • HIR 2-22-2018 Symposium Summary
  • Manuscripts Plan
  • SEMICON West Plan
  • 2018 Events

8:30 am to 9:00 am Conference Room 1

TWG Chairs Q&A Caucus

Session 1 - Room 1 Session Moderator: Subramanian Iyer , Co-moderator Tom Salmom

Heterogeneous Integration for High Performance

09:00-09:30 am High Performance Computing & Data Center

Kanad Ghose (Binghamton U), Rockwell Hsu (Cisco)

09:30-10:00 am Thermal Management Mahdu Iyenger (Google), Azmat Malik (Acuventure)

10:00-10:30 am 3D +2.5D Ravi Mahajan (Intel),

10:30-11:00 am WLP (fan in and fan out) Rozalia Beica (DOW), John Hunt (ASE)

11:00-11:30 am Integrated Photonics Amr Helmy (U Toronto), Bill Bottoms (3MTS)

11:30 -12 noon Test Dave Armstrong (Advantest)

Session 2 - Room 4 Session Moderator: Dick Otte, Co-moderator Annette Teng.

Heterogeneous Integration for Consumer & Industrial Applications

09:00-09:30 am Medical and Health & Wearable Mark Poliks (Binghamton U), Nancy Stoffel (GE)

09:00-10:00 am SiP & Module Rolf Aschenbrenner, Klaus Dieter Lang (Fraunhofer IZM), Klaus Pressel (Infineon)

10:00-10:30 am Single Chip and Multi Chip Packaging William Chen (ASE), Annette Teng (Promex)

10:30-11:00 am Integrated Power Package Doug Hopkins (NCSU)

11:00-11:30 am Emerging Devices Meyya Meyyappan (NASA Ames)

11:30-12 noon IoT Robert Lo (ITRI Taiwan)

Session 3 - Room 1 Session Moderator: Luke England Co-Moderator Bill Bottoms.

Heterogeneous Integration for Special Applications

1:00 - 1:30 pm Aerospace & Defense Tim Lee (Boeing), Daniel Green (DARPA)

1:30 - 2:00 pm 5G in RF and Analog Mixed Signal Tim Lee (Boeing), Herbert Bennett (Alta Tech)

2:00 - 2:30 pm Interconnect Subramanian Iyer (UCLA), Adeel Bajwa (KnS)

2:30 - 3:00 pm MEMS & Sensor integration Shafi Saiyed (ADI)

3:00 - 3:30 pm Cyber Security Sohrab Aftabjahani (Intel)

Session 4 - Room 4 Session Moderator Ravi Mahajan Co-Moderator Venky Sundaram

Heterogeneous Integration Applications, Materials & Simulation

1:00 - 1:30 pm Mobile William Chen (ASE)

1:30 - 2:00 pm Automotive Venky Sundaram (GT), Urmi Ray (STATS Chippak)

2:00 - 2:30pm Co-Design Andrew Kahng

2:30 - 3:00 pm Simulation Christopher Bailey (Greenwich U), Xuejun Fan (Lamar)

3:00 - 3:30 pm Materials & Emerging Research Materials Bill Bottoms (3MTS), Myung Jin Yim ( Intel)

3:30 - 4:00 pm Supply Chain Tom Salmon (SEMI)

4:30 - 5:00 pm Conference Room 1

Workshop Wrap-Up

  • Cross TWG collaborations
  • Manuscript Completion
  • SEMICON West Plan (July 8, July 9, July 11)
  • 2018 Events

Co-Moderators will be responsible to have a tablet as a timer and be responsible for coordinating with their concurrent sessions to stay on schedule.

Speakers will have introduction as their first chart. There will be 20 minutes for presentation and 10 minutes for Q&A.

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