IEEE Intersociety Thermal and Thermomechanical Conference


IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Welcome to ITherm 2018
The Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems

May 29 - June 1, 2018

Sheraton Hotel & Marina San Diego, CA USA

(Co-Located with ECTC)

Registration is now open. We invite you to register for ITherm 2018 using our Cvent website at:

Sponsored by the IEEE's Electronics Packaging Society (EPS), ITherm 2018 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. The first ITherm Conference was held in 1988, making this the 30th year of the Conference Series.

ITherm 2018 will be held along with the 66th Electronic Components and Technology Conference (ECTC 2018 -, a premier electronics packaging conference at the Sheraton Hotel and Marina in San Diego. Joint registrations are available at a discounted rate. In addition to paper presentations and vendor exhibits, ITherm 2018 will have panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional short courses. All papers will be peer reviewed and published in the ITherm proceedings. Student first authors will have the opportunity to apply for ITherm travel grants in order to make an oral presentation and participate in a Student Poster and Networking Session.

We invite you to submit an abstract for ITherm 2018!

Important Dates:

Deadline for Abstracts September 18, 2017
Notification of Acceptance October 16, 2017
Draft Paper Submission (Extended) January 15, 2018
Reviews Returned February 5, 2018
Final Paper Submission March 5, 2018
Author Registration Deadline April 2, 2018
ITherm Conference Begins May 29, 2018

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