IEEE Intersociety Thermal and Thermomechanical Conference

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IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Welcome to ITherm 2019
The Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems

May 28 - May 31, 2019


The Cosmopolitan of Las Vegas, Las Vegas, NV USA

(Co-Located with ECTC)

Sponsored by the IEEE's Electronics Packaging Society (EPS), ITherm 2019 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.

ITherm 2019 will be held along with the 67th Electronic Components and Technology Conference (ECTC 2019 - http://www.ectc.net), a premier electronics packaging conference at The Cosmopolitan of Las Vegas, Las Vegas, NV USA. Joint registrations will be available at a discounted rate. In addition to paper presentations and vendor exhibits, ITherm 2019 will include panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional short courses.

All papers will be peer reviewed and published in the ITherm proceedings. Student first authors will have the opportunity to apply for ITherm travel grants in order to make an oral presentation and participate in a Student Poster and Networking Session.

We invite you to submit an abstract for ITherm 2019!

Important Dates:

Deadline for Abstracts September 3, 2018
Notification of Acceptance October 15, 2018
Draft Paper Submission December 17, 2018
Reviews Returned February 4, 2019
Final Paper Submission March 4, 2019
Author Registration Deadline April 1, 2019
ITherm Conference Begins May 28, 2019

Connect with ITherm:

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