Sponsored by the IEEE's Electronic Packaging Society (EPS), ITherm 2018 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. The first ITherm Conference was held in 1988, making this the 30th year of the Conference Series.
ITherm 2018 will be held along with the 66th Electronic Components and Technology Conference (ECTC 2018 - http://www.ectc.net), a premier electronics packaging conference at the Sheraton Hotel and Marina in San Diego. Joint registrations are available at a discounted rate. In addition to paper presentations and vendor exhibits, ITherm 2018 will have panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional short courses. All papers will be peer reviewed and published in the ITherm proceedings. Student first authors will have the opportunity to apply for ITherm travel grants in order to make an oral presentation and participate in a Student Poster and Networking Session.
We invite you to submit an abstract for ITherm 2018!
|Deadline for Abstracts||September 18, 2017|
|Notification of Acceptance||October 16, 2017|
|Draft Paper Submission||December 18, 2017|
|Reviews Returned||February 5, 2018|
|Final Paper Submission||March 5, 2018|
|Author Registration Deadline||April 2, 2018|
|ITherm Conference Begins||May 29, 2018|
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