IEEE Intersociety Thermal and Thermomechanical Conference

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IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

ECTC/ITherm Joint Women's Panel


ENHANCING WOMEN'S PARTICIPATION IN ENGINEERING - A VIEW AROUND THE GLOBE

WEDNESDAY, MAY 30, 6:30 - 7:30 PM, MARINA TOWER, HARBOR ISLAND 3


Moderators: Cristina Amon (University of Toronto); Tanja Braun (Fraunhofer IZM)

The Executive Committees of ECTC and ITherm cordially invite all ITherm attendees to our fourth annual Women's Panel and Reception jointly organized by ITherm and ECTC and sponsored by EPS. The four panelists will speak on their experiences and achievements in the microelectronics industry and provide insights into enhancing women's participation in engineering around globe. A Q&A session and reception for panelists and attendees will follow.


Panelists: Kawthar (Kat) Kasim (Engineer, Boeing Research and Technology, USA); Jayathi Murthy (Dean of Engineering, UCLA, USA); Ming Li (R&D Director, Enabling Technologies at ASM Pacific Technology, Hong Kong) Cristina Amon Tanja Braun Kawthar Kasim Jayathi Murthy Ming Li


Cristina Amon

Cristina Amon
Tanja Braun

Tanja Braun
Kawthar Kasim

Kawthar Kasim
Jayathi Murthy

Jayathi Murthy
Ming Li

Ming Li

Panelists' Bios

Kawthar Kasim is a Thermal Design and Analysis Engineer at Boeing Research and Technology working on additive manufacturing of thermal management devices such as cold plates, heat exchangers, and heat pipes. She has been with the Boeing Company for 12 years and has worked in other positions at Boeing such as in the R&D Acoustics and Aerosciences Division and i the Flight and Controls Division of Boeing Satellites. She has a MS in Mechanical Engineering from Stanford University and BS in Applied Math from UC Berkeley


Jayathi Murthy is the Ronald and Valerie Sugar Dean of the Henry Samueli School of Engineering and Applied Science at the University of California, Los Angeles. Previously she held the Ernest Cockrell Jr. Chair and served as Department Chair of Mechanical Engineering at The University of Texas at Austin. She also served as Director of the Center Prediction of Reliability, Integrity, and Survivability of Microsystems (PRISM) at Purdue from 2008-2014. She received her Ph.D degree from the University of Minnesota in the area of numerical heat transfer and has worked in both academia and in industry. She was an early employee of Fluent Inc., where she developed the widely-used unstructured solution-adaptive finite volume methods that underlie their flagship software Fluent, and the electronics cooling software package ICEPAK. More recently, her research has addressed sub-micron thermal transport, multiscale multiphysics simulations of MEMS and NEMS and uncertainty quantification in these systems. She is the recipient of several awards including the 2012 ASME EPPD Clock Award, and 2016 ASME Heat Transfer Memorial Award, for her contributions to the development of advanced computational techniques.


Ming Li was awarded BSc and MSc in Materials Science and Engineering by Shanghai Jiao Tong University, China, and earned her PhD in Materials Science from the University of London, UK. Before joining ASM in June 2004, Dr Li worked in the University of London (UK), the Institute of Materials Research and Engineering (Singapore), and Chinese University of Hong Kong (Hong Kong). Currently, working in ASM as a R&D Director for Enabling Technology, Dr. Li is heading the Process and Packaging Technology Development Team to improve current processes and explore advanced packaging technologies. Dr. Li has published near 100 papers in leading journals and technical conferences.



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