IEEE Intersociety Thermal and Thermomechanical Conference

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IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Program


In addition to paper presentations and vendor exhibits, ITherm 2018 will have panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional development courses. Other activities include the Student Poster and Networking Session and Art-in-Science Exhibition.

KEYNOTES

Ravi Kuppuswamy

FPGAs: The Accelerator of Choice from the Edge to the Cloud
Ravi Kuppuswamy
Intel Corporation
Sean Ross

Transitioning Directed Energy Weapons From The Laboratory To The Tactical Edge: The Thermal Interface
Sean Ross
Air Force Research Laboratory
Paolo Petagna

Detector Thermal Management with CO2 Boiling Systems at CERN
Paolo Petagna
CERN

INVITED TECH TALK SESSIONS

  • TT-3: CRYOGENIC COOLING FOR QUANTUM COMPUTING AND EMBEDDED COOLING ENABLED ELECTRIC MOTORS
  • TT-5: HETEROGENOUS INTEGRATION
  • TT-7: THERMAL MANAGEMENT IN AEROSPACE/AUTOMOTIVE
  • TT-9: ADDITIVE MANUFACTURING/THERMAL TOPOLOGY OPTIMIZATION
  • TT-11: NEXT GEN CHALLENGES IN NUMERICAL MODELING

PANEL SESSIONS

  • P-2: MICRO-TWO-PHASE LIQUID COOLING SYSTEMS FOR ELECTRONICS
  • P-4: THERMO-FLUIDIC CHALLENGES IN HEALTHCARE
  • P-6: THERMAL MANAGEMENT OF MOBILE/IOT DEVICES
  • P-8: EMERGING TRENDS IN ENERGY MANAGEMENT AND THERMAL PACKAGING OF DATA CENTERS
  • P-10: THERMAL MANAGEMENT IN ELECTRONICS: MATERIALS, DEVICES, AND DATA CENTERS

PROFESSIONAL DEVELOPMENT COURSES

  • PDC01: Achieving High Reliability of Lead-Free Solder Joints - Materials Considerations Course Leader: Ning-Cheng Lee - Indium Corporation
  • PDC02: Introduction to Fan-Out Wafer Level Packaging Course Leader: Beth Keser - Intel Corporation
  • PDC03: Fundamentals of Glass Technology and Applications for Advanced Semiconductor Packaging Course Leader: Aric Shorey - Corning, Inc.
  • PDC04: Future of Device and Systems Packaging in Post Moore's Law Course Leader: Rao Tummala - Georgia Institute of Technology
  • PDC05: Introduction to Mechanics Based Quality and Reliability Assessment Methodology Course Leaders: Shubhada Sahasrabudhe and Sandeep Sane - Intel Corporation
  • PDC06: Polymers and Nanocomposites for Electronic and Photonic Packaging Course Leaders: C. P. Wong - Georgia Institute of Technology; Daniel Lu - Henkel Corporation
  • PDC07: Fundamentals of RF Design and Fabrication Processes of Fan-Out Wafer Level Packages and Interposers Course Leaders: Ivan Ndip and Markus Wöhrmann - Fraunhofer IZM
  • PDC08: Reliability Mechanics and Modeling for IC Packaging - Theory, Implementation and Practices Course Leaders: Ricky Lee - HKUST, and Xuejun Fan - Lamar University
  • PDC09: Integrated Thermal Packaging and Reliability of Power Electronics Course Leader: Patrick McCluskey - University of Maryland
  • PDC10: Flip Chip Fabrication and Interconnection Course Leaders: Eric Perfecto - GlobalFoundries; Shengmin Wen - Synaptics Inc.
  • PDC11: Wafer Level Chip Scale Packaging Course Leader: Luu Nguyen - Texas Instruments, Inc.
  • PDC12: Flexible Hybrid Technologies - Manufacturing and Reliability Course Leader: Pradeep Lall - Auburn University
  • PDC13: Fan-Out Wafer-Level Packaging and 3D Packaging Course Leader: John Lau - ASM Pacific Technology Ltd.
  • PDC14: Polymers for Electronic Packaging Course Leader: Jeffrey Gotro - InnoCentrix, LLC
  • PDC15: Corrosion in Microelectronic Packages Course Leader: Varughese Matthew - NXP Semiconductors
  • PDC16: Ageing of Polymers and the Influence on Microelectronic Package Reliability Course Leaders: Tanja Braun and Ole Hölck - Fraunhofer IZM
  • PDC17: Package Failure Mechanisms, Reliability, and Solutions Course Leader: Darvin Edwards - Edwards Enterprises
  • PDC18: Design and Optimization of Heat Sinks Course Leaders: Marc Hodes - Tufts University; Georgios Karamanis - Transport Phenomena Technologie

TECHNICAL PROGRAM

COMPONENT-LEVEL THERMAL MANAGEMENT
  • TI-1A: 3D Packaging / 3D Embedded Cooling I
  • TI-1B: Vapor Chambers and Heat Pipes
  • TI-2: 3D Packaging / 3D Embedded Cooling II
  • TI-3: Single/Multi Chip Module (MCM) and System in Package (SIP) I
  • TI-4: Single/Multi Chip Module (MCM) and System in Package (SIP) I
  • TI-5: Hot Spot Cooling and Jet Impingement I
  • TI-6: Hot Spot Cooling and Jet Impingement II
  • TI-7A: Thermal Interface Materials, Heat Spreaders, and Thermal Ground Planes
  • TI-7B: Air Cooling and Heat Exchangers
  • TI-8A: Novel Air Cooling Devices and Systems
  • TI-8B: Characterization of Materials and Structures for Thermal Management of Electronics
  • TI-9: Board-Level Liquid Cooling Solutions
  • TI-10: Boiling, Condensation, Evaporation, and Microgap Cooling I
  • TI-11: Boiling, Condensation, Evaporation, and Microgap Cooling II
  • TI-12A: Single/Two-Phase Flow in Microchannels and Cold Plates
  • TI-12B: Thermoelectricity, TEC, and Peltier Devices
SYSTEM-LEVEL THERMAL MANAGEMENT
  • TII-1: Data Center Energy Efficiency I
  • TII-2: Data Center Energy Efficiency II
  • TII-3: LEDs and Photovoltaics
  • TII-4: Power Electronics
  • TII-5: Immersion Cooling and Refrigeration
  • TII-6: Data Center and Energy Efficiency III
  • TII-8: Space, Aerospace, and Telecommunications
  • TII-9: Automotive, Batteries, and Thermal Storage
  • TII-10: Data Center Energy Efficiency IV
  • TII-11: Mobile, Internet of Things I
  • TII-12: Mobile, Internet of Things II
EMERGING TECHNOLOGIES & FUNDAMENTALS
  • E-1: Fundamentals of Boiling and Condensation
  • E-2: Flexible Electronics
  • E-3: Thermal Transport in Nanotechnology
  • E-4: Thermal Numerical Methods, Nano-To-Macro Scale
  • E-5: Thermal Interface Materials and Phase Change Materials I
  • E-6: Thermal Interface Materials and Phase Change Materials II
  • E-7: Convection in Channels and Jets
  • E-9: Thermal Experimental Methods, Nano-To-Macro Scale I
  • E-10: Thermal Experimental Methods, Nano-To-Macro Scale II
  • E-11: Emerging Materials and Thermal Phenomena I
  • E-12: Emerging Materials and Thermal Phenomena II
MECHANICS & RELIABILITY
  • M-1: Applied Reliability and Failure Analysis
  • M-2: Advanced Methodologies for Reliability
  • M-3: Mechanics in Assembly and Packaging I
  • M-4: Mechanics in Assembly and Packaging II
  • M-5: Modeling and Analytical Methods for Mechanics and Reliability of Electronic Packaging I
  • M-6: Modeling and Analytical Methods for Mechanics and Reliability of Electronic Packaging II
  • M-7: Solder Joint Reliability I
  • M-8: Solder Joint Reliability II
  • M-9: Solder Characterization and Modeling I
  • M-10: Solder Characterization and Modeling II
  • M-11: Thermal-Mechanical Interactions in Microelectronics Packages and Systems
  • M-12: Thermal-Mechanical Interactions in Microelectronics Packages and Systems II


ITherm Sponsors

Gold Sponsors

Silver Sponsor

Registration Lanyard Sponsor

ITherm Partners

ITherm Exhibitors



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