IEEE Intersociety Thermal and Thermomechanical Conference


IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems


In addition to paper presentations and vendor exhibits, ITherm 2018 will have panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional development courses. Other activities include the Student Poster and Networking Session and Art-in-Science Exhibition.


Dan McNamara

Dan McNamara
Intel Corporation
FPGAs: The Accelerator of Choice from the Edge to the Cloud
Paolo Petagna

Paolo Petagna
Detector Thermal Management with CO2 Boiling Systems at CERN
Sean Ross

Sean Ross
Air Force Research Laboratory
Transitioning Directed Energy Weapons from the Laboratory to the Tactical Edge: The Thermal Interface


  • Heterogeneous Integration/3D Chip Cooling
  • Additive Manufacturing/Thermal Topology Optimization
  • Next Generation Challenges in Numerical Modeling
  • Thermal Management in Aerospace/Automotive
  • Quantum and Crypto Computing Thermal and Energy Challenges


  • Micro-Two-Phase Liquid Cooling Systems for Electronics
  • Thermal Management of Mobile/IoT Devices
  • Energy Mgmt and Thermal Packaging of Data Centers
  • Nanoscale Thermals: Modeling, Applications and Advances
  • Healthcare Thermal Management


  • Design and Optimization of Heat Sinks
  • Integrated Thermal Packaging and Reliability of Power Electronics
  • Plus.... 16 More Courses on a Variety of Topics


Component-Level Thermal Management
  • Single/Multi Chip Module & System in Package
  • 3D Packaging & Embedded Cooling
  • Hotspot & Impingement Cooling
  • Passive Two-Phase Cooling: Heat Pipes, Vapor Chambers, & Thermosyphons
  • Pulsating/Oscillating & Non-conventional Heat Pipes
  • Thermal Interface Materials and Heat Spreaders
  • Thermoelectricity & Peltier Devices
  • Novel Air Cooling Techniques & Heat Exchangers
  • Pumps, Compressors, Fans & Blowers
  • Single-Phase Liquid & Two-Phase Cold Plates
  • Boiling/Evaporation/Condensation, Microgap Cooling
System-Level Thermal Management
  • Data Center Energy Efficiency
  • Thermal Storage
  • Immersion Cooling, Refrigeration
  • Mobile, Internet of Things, MEMS
  • Telecommunication Systems
  • Automotive
  • Space and Aerospace
  • Power Electronics
  • LEDs
  • Photovoltaics
  • RF Electronics
  • Batteries
Mechanics & Reliability
  • Thermo-Mechanical Modeling and Simulation of Devices, Components, Boards, and Systems
  • Mechanics and Reliability of Solder Joints & Interconnects
  • Materials Characterization, Processing, Constitutive Models
  • Failure Mechanics, Fatigue, Damage Modeling
  • Experimental Techniques for Packaging Deformations, Strains, and Stresses
  • Shock, Drop, and Vibrational Analysis of Packages, Sub-Systems, and Systems
  • TSV / 3D Reliability and Packaging Challenges
  • Mechanics Issues in Assembly and Manufacturing
  • Applied Reliability for Failure Detection and Characterization
  • Process-Structure-Property Correlations / Multi-Scale Analyses for Degradation and FailureM
  • Accelerated Stress Testing and Modelling
  • Lifetime Prognostics and Condition Monitoring
Emerging Technologies and Fundamentals
  • Numerical Methods from Nano-to-Macro Scale
  • Experimental Methods from Nano-to-Macro Scale
  • Nanotechnology Including 1-D and 2-D Materials
  • Thermal Interface Materials and Phase Change Materials
  • Embedded Cooling
  • Transistor Technology
  • Novel Materials and Fabrication Techniques
  • Measurement and Instrumentation Techniques
  • Prognostic Health Management and Reliability Analysis
  • Flexible Electronics

ITherm Partners