Heterogeneous Integration/3D Chip Cooling
Explore the advanced in 3D packaging and heterogenous integration for both high power RF devices and silicon CMOS
Additive Manufacturing/Thermal Topology Optimization
Additive Technology has given the engineer of the future unparalleled design flexibility, these talks will explore in depth current state art and future vision thermal topology design optimization additive manufacturing technology
Next Generation Challenges in Numerical Modeling
Computational simulation of heat and fluid flow have become critical to the design and analysis of electronics cooling components and devices. This session will focus on both the refinement of existing methods, particularly with respect to incorporation of coupled, multi-physics phenomena and trustability established through verification, validation, and uncertainty quantification. The session will also address how new insights at atomistic length scales can be incorporated into predictive model tools at the device level.
Thermal Management in Aerospace/Automotive
Addresses emerging technologies and challenges for automotive and aerospace thermal management
Quantum and Crypto Computing Thermal and Energy Challenges
Crypto-Currency Mining and Quantum computing are "hot" emerging technologies posing new energy and thermal challenges. It has been estimated that Bitcoin mining energy consumption rivals that of a small nation, and that quantum computers are able to perform calculations beyond any capability seen before. Cooling these new technologies poses new challenges and opportunities for the thermal community. This session brings together experts in these fields who will share their perspectives on these challenges today and their vision of the future.