Application/Nomination Link: Click here
Deadline: March 30, 2026
| Tech Talks are 30-minute seminar-style sessions given by an expert in the area. The goal is to provide lectures and tutorials on hot topics and major efforts in the field that would not be feasible in a paper presentation. Tech Talks are being sought in the following areas of interest. New topical areas can also be suggested in the application form. – 3D Heterogeneous Integration – Future of High-Performance Heat Sinks – Advances in Data Center Cooling and Intelligent Thermal Control – Thermal management of Photonic and Quantum Systems – Thermal Packaging in Aviation/Space Defense Systems – Managing Heat in Wearable, Implantable, and Human-Interfacing Robots | Panels are 90-minute dynamic sessions with 4-6 experts in the field presenting and then discussing a special topic of interest to the community. The goal is to provide an opportunity for the community to engage with diverse experts and share knowledge and learning. Panelists in the following areas of interest are being sought. New panels can also be suggested in the application form. – Federal Funding & Programs Workshop – HPC Data Centers – Mobile, AI, Automotive, and High-Power-Density Applications – Photonics and Optoelectronics – Advanced Manufacturing – Mechanics and Reliability – Quantum and Cryogenics |
Tech Talk speakers and Panelists are provided a 20% registration discount to the conference
If you interested in these special opportunities to present, teach and discuss your work, please use the link above to apply for a Tech Talk or Panel speaking slot. You can also use this form to nominate someone you know for one of these events, and the organizers will reach out to the nominee to confirm their participation and details of the talk.