IEEE Intersociety Thermal and Thermomechanical Conference

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IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

ITherm 2020 Virtual


ITherm 2020 Virtual is being hosted by IEEE Meetings, Conference, and Events (MCE) to bring the event to you using the ON24 virtual conference environment. Registered attendees to ITherm 2020 Virtual can use the links below to access the ON24 platform for both the live and pre-recorded content.

As a reminder, in order to be authenticated into ON24, you must login using the same email address that you registered for ITherm 2020 with.

Below is a listing of tracks, sessions, and papers for all ITherm 2020 Virtual. Clicking on the corresponding link for the session you wish to join will launch the ON24 platform.

Please register at least 24 hours prior to the event to ensure that your access credentials are valid. Registration will remain open through the close of the conference on August 19, 2020.


ITherm 2020 Virtual Recorded Content
July 21 - August 19, 2020


Pre-recorded presentations will be available for all registered attendees to view during the period of July 21 - August 19, 2020.


STUDENT POSTER ELEVATOR PITCHES


Heterogeneous Integration Roadmap (HIR) Workshop


ECTC/ITherm Joint Diversity Panel


Session Paper Presentations

Post questions to the ON24 chat widget, which will be monitored and addressed by the authors throughout the event period.


COMPONENT-LEVEL THERMAL MANAGEMENT


SYSTEM-LEVEL THERMAL MANAGEMENT


EMERGING TECHNOLOGIES & FUNDAMENTALS


MECHANICS & RELIABILITY


Live Virtual Conference
July 21 - 23, 2020


The live virtual conference content is available to all registered attendees of ITherm 2020 Virtual. The live content is only available during the noted times and recordings will not be made available.


Day 1

Tuesday July 21, 12:00 PM - 4:00 PM Eastern

Join Day 1 Live Event


12:00 PM - 1:00 PM Eastern Keynote 1:
Future of Work Depends on Ethics in AI
1:30 PM - 2:30 PM Eastern Richard Chu ITherm Award for Excellence
3:00 PM - 4:00 PM Eastern Tech Talk Session 1:
Heterogeneous Integration

Day 2

Wednesday July 22, 12:00 PM - 4:00 PM Eastern

Join Day 2 Live Event


12:00 PM - 1:00 PM Eastern Keynote 2:
The Future of 3D System Integration Technology
1:30 PM - 2:30 PM Eastern Tech Talk Session 2:
AI in Thermal Management
3:00 PM - 4:00 PM Eastern Tech Talk Session 3:
Transient Thermal Management

Day 3

Thursday July 23, 12:00 PM - 4:00 PM Eastern

Join Day 3 Live Event


12:00 PM - 1:00 PM Eastern Keynote 3:
Aircraft Electrification Feasibility and Thermal
Management Challenges
1:30 PM - 2:45 PM Eastern ASME K-16 Student Heat Sink Challenge
3:15 PM - 4:00 PM Eastern Best Paper Awards and Closing

For technical issues with accessing ON24, please contact David Stankiweicz (d.stankiewicz@ieee.org) or Brett Houseal (b.houseal@ieee.org )from IEEE MCE.

ITherm Sponsors

Sponsors

George-Woodruff-School


UTA


GE

ITherm Exhibitors

Exhibitors


Staubli

Staubli

Staubli

ITherm Partners

Partners



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