IEEE Intersociety Thermal and Thermomechanical Conference


IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Richard Chu ITherm Award for Excellence in Thermal and Thermo-Mechanical Management of Electronics

The ITherm 2021 Awards Committee is seeking nominations for the Richard Chu Award for Excellence in Thermal and Thermo-Mechanical Management of Electronics. The Award is presented annually in recognition of significant contributions made in thermal and thermo-mechanical aspects of electronics devices and systems. It honors the memory of Richard Chu, the first recipient of the ITherm Achievement Award and a seminal contributor to thermal management of electronics.

The Award, to be presented at the 2021 virtual ITherm Conference, includes a memento, a plaque, and a $1500 honorarium. Conference registration will be complimentary. The recipient is expected to present an Invited Lecture on a topic of relevance to the conference themes.

The selection criterion and required nomination materials are detailed below.

The sole selection criterion for the award is seminal contributions to the science and art of thermal and/or thermo-mechanical aspects of electronic devices and systems as demonstrated by archival publications in prestigious journals, patents, or other groundbreaking achievements. Service and societal activities, although relevant will not be major considerations for selection. IEEE-EPS membership is encouraged but not required. Additional details on the Award,including a list of past recipients is available at:

The nomination should include:

1. A two-page letter from the nominator summarizing the nominee's qualifications,

2. Up to three letters of support (a minimum of two are required), and

3. A detailed curriculum vitae.

Nomination packets should be submitted by March 8, 2021 to :

Prof. Sushil H. Bhavnani, Awards Chair,

Dr. Koneru Ramakrishna, Awards Co-chair,

Prof. Yogendra K. Joshi, Awards Co-chair,

ITherm Partners