IEEE Intersociety Thermal and Thermomechanical Conference


IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

ITherm Achievement Award 2008

Dr. Roger R. Schmidt

Dr. Roger R. Schmidt, Distinguished Engineer, National Academy of Engineering Member, IBM Academy of Technology Member and ASME Fellow, has over 25 years experience in engineering and engineering management in the thermal design of IBM's large scale computers. He has led development teams in cooling mainframes, client/servers, parallel processors and test equipment utilizing such cooling mediums as air, water, and refrigerants. He now leads our lab services team on providing customer support for power and cooling issues in data centers. He has published more than 100 technical papers and has over 100 patents/patent pending in the area of electronic cooling. He is a member of ASME Heat Transfer Division and an active member of the K-16 Electronic Cooling Committee. He has been an Associate Editors of the Journal of Electronic Packaging and the ASHRAE Research Journal and is now Associate Editor of the ASME Journal of Heat Transfer. He has taught extensively over the past 25 years Mechanical Engineering courses for prospective Professional Engineers and has given seminars on electronic cooling and power and cooling trends of IT equipment to a number of organizations. He is Chair of the ASHRAE TC9.9 committee on Mission Critical Facilities, Technology Spaces, and Electronic Equipment.