IEEE Intersociety Thermal and Thermomechanical Conference


IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

ITherm Achievement Award 2012

Dr. Yogendra Joshi

Yogendra Joshi is Professor and John M. McKenney and Warren D. Shiver Distinguished Chair at the G.W. Woodruff School of Mechanical Engineering at the Georgia Institute of Technology. His research interests are in multi-scale thermal management. He received a Bachelor of Technology degree in Mechanical Engineering from the Indian Institute of Technology in Kanpur in 1979, Master of Science in Mechanical Engineering from the State University of New York, Buffalo in 1981, and a Doctor of Philosophy in Mechanical Engineering and Applied Mechanics, from the University of Pennsylvania in 1984. He is the author or co-author of over 260 archival journal and conference publications, and is an elected Fellow of the ASME, the American Association for the Advancement of Science, and IEEE. He has advised or co-advised 20 Ph.D. students and 44 M.S. students. He has served as Associate Editor for the ASME J. of Electronics Packaging (two terms) and the ASME J. Heat Transfer, and is currently an Associate Editor for the IEEE Transactions in Components and Packaging Technologies. He was a co-recipient of ASME Curriculum Innovation Award (1999), Inventor Recognition Award from the Semiconductor Research Corporation (2001), the ASME Electronic and Photonic Packaging Division Outstanding Contribution Award in Thermal Management (2006), ASME J. of Electronics Packaging Best Paper of the Year Award (2008), IBM Faculty Award (2008), IEEE Semitherm Significant Contributor Award (2009), IIT Kanpur Distinguished Alumnus Award (2011), and ASME InterPack Achievement Award (2011).

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