IEEE Intersociety Thermal and Thermomechanical Conference

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IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Best Paper Awards


ITherm 2020 Virtual Best Paper Awards Committee

Prof. Mehmet Arik, Özyeğin University, Turkey

Prof. Mehdi Asheghi, Stanford University, USA

Prof. Christopher Bailey, University of Greenwich, UK

Prof. Cemal Basaran, SUNY Buffalo, USA

Prof. Sushil H. Bhavnani, Auburn University, USA

Prof. Kuo-Ning Chiang, National Tsing Hua University, Taiwan

Dr. Victor A. Chiriac, Global Cooling Technology Group, USA

Dr. Krishna Darbha, Microsoft Corp., USA

Dr. Peter deBock, General Electric Research, USA

Dr. M. Baris Dogruoz, CISCO Corp., USA

Prof. Joshua Gess, Oregon State University, USA

Dr. Przemyslaw J. Gromala, Robert Bosch GmbH, Germany

Dr. Ashish Gupta, Intel Corp., USA

Prof. Marc S. Hodes, Tufts University, USA

Dr. Madhusudhan Iyengar, Google, USA

Prof. Yogendra K. Joshi, Georgia Institute of Technology, USA, Committee Chair

Dr. Ravi Mahajan, Intel Corp., USA

Prof. Tim Persoons, Trinity College, University of Dublin, Ireland

Dr. Koneru Ramakrishna, Thermal Consultant, USA, Committee Co-Chair

Prof. Roger Schmidt, Syracuse University, USA

Prof. Amir H. Shooshtari, University of Maryland, USA

Dr. Kamak Sikka, IBM Corp., USA

Prof. Jeffrey Suhling, Auburn University, USA, Committee Co-Chair


ITherm 2020


COMPONENT-LEVEL THERMAL MANAGEMENT

Best Paper Award

  • Remco Van Erp, Georgios Kampitsis, Luca Nela, Reza Soleimanzadeh Ardebili, and Elison Matioli, "Embedded Microchannel Cooling for High Power-Density GaN-on-Si Power Integrated Circuits"

Outstanding Paper Award

  • David C. Deisenroth, Michael Ohadi, and Avram Bar-Cohen, "Heat Transfer and Two-Phase Flow Regimes in Manifold Microgaps: Performance Comparison Between R245fa and FC-27"

SYSTEM-LEVEL THERMAL MANAGEMENT

Best Paper Award

  • Jackson B. Marcinichen, Raffaele L. Amalfi , Filippo Cataldo, and John R. Thome, "General Thermosyphon Simulation Code for Electronics Cooling Applications"

Outstanding Paper Award

  • James Vangilder, Yatharth Vaishnani, Wei Tian, and Michael Condor, "A Compact Rack Model for Data Center CFD Modeling"

MECHANICS AND RELIABILITY TRACK

Best Paper Award

  • Stoyan Stoyanov, Chris Bailey, Rhys Waite, Christopher Hicks, and Terry Golding, "Modelling Indium Interconnects for Ultra Fine-Pitch Focal Plane Arrays"

Outstanding Paper Award

  • Pradeep Lall, Tony Thomas, and Ken Blecker, "RUL Estimations of SAC305 Solder PCB's under Different Conditions of Temperature and Vibration"

EMERGING TECHNOLOGIES AND FUNDAMENTALS TRACK

Best Paper Award

  • Darin J. Sharar, Adam A. Wilson, Asher Leff, Andrew Smith, K. Can Atil, Alaa Elwany, Raymundo Arroyave, and Ibrahim Karaman, "Additively Manufactured Nitinol as a Solid-State Phase Change Material"

Outstanding Paper Award

  • Farid Soroush, Ki Wook Jung, Mehdi Asheghi, Madhusudan Iyengar, and Chris Malone, "Mechanical Design and Reliability of Gold-Tin Eutectic Bonding for Silico-based Thermal Management Devices"

ITherm 2019


COMPONENT-LEVEL THERMAL MANAGEMENT

Best Paper

Outstanding Paper


SYSTEM-LEVEL THERMAL MANAGEMENT

Best Paper

  • Shurong Tian, Todd Takken, Mark Shultz, Chris Marroquin, Vic Mahaney, Yuan Yao, Michael J Ellsworth Jr, Anil Yuksel, and Paul Coteus, "A Single Flexible Cold Plate Cools Multiple Devices." https://doi.org/10.1109/ITHERM.2019.8757281

Outstanding Paper


MECHANICS & RELIABILITY

Best Paper

  • Rainer Dudek, Kerstin Kreyssig, Sven Rzepka, Michael Novak, Wolfgang Gruebl, Peter Fruehauf, and Andreas Weigert, "Comparisons of Solder Joints Fatigue Life Predictions and Several Long-Term Testing Results." https://doi.org/10.1109/ITHERM.2019.8757318

Outstanding Paper


EMERGING TECHNOLOGIES & FUNDAMENTALS

Best Paper

Outstanding Paper(Tie)

  • Martinus Arie, David Hymas, Farah Singer, Amir Shooshtari, and Michael Ohadi, "Performance Characterization of a Novel Cross-Media Composite Heat Exchanger for Air-to-Liquid Applications." https://doi.org/10.1109/ITHERM.2019.8757258
  • Aaditya Anand Candadai, Justin Weibel, and Amy Marconnet, "A Measurement Technique for Thermal Conductivity Characterization of Ultra- High Molecular Weight Polyethylene Yarns Using High-Resolution Infrared Microscopy." https://doi.org/10.1109/ITHERM.2019.8757385

ITherm 2018


COMPONENT-LEVEL THERMAL MANAGEMENT

Best Paper

Outstanding Paper

  • Thomas Germain, Tanvir A. Chowdhury, Jake Carter, and Shawn A. Putnam. "Measuring Heat Transfer Coefficients for Microchannel Jet Impingement Using Time-domain Thermoreflectance." https://doi.org/10.1109/ITHERM.2018.8419486

SYSTEM-LEVEL THERMAL MANAGEMENT

Best Paper

Outstanding Paper


MECHANICS & RELIABILITY

Best Paper

  • Bernhard Wunderle, Daniel May, Jens Heilmann, Joerg Arnold, Josef Hirscheider, Y. Li, Joerg Bauer, Mohamad Abo Ras "A Novel Concept for Accelerated Stress Testing of Thermal Greases and In-situ Observation of Thermal Contact Degradation." https://doi.org/10.1109/ITHERM.2018.8419568

Outstanding Paper


EMERGING TECHNOLOGIES & FUNDAMENTALS

Best Paper

  • Quang N. Pham, Shiwei Zhang, Lin Cheng-Hui, Shuai Hao, and Yoonjin Won "Boiling Heat Transfer Performance of Three-dimensionally Ordered Microporous Copper with Modulated Pore Diameters" https://doi.org/10.1109/ITHERM.2018.8419479

Outstanding Paper


ITherm 2017


COMPONENT-LEVEL THERMAL MANAGEMENT

Best Paper

  • Sircar, J. D., D. F. Hanks, Z. Lu, T. Salamon, K. R. Bagnall, S. Narayanan, D. Antao, B. Barabadi, and E. N. Wang. "High Heat Flux Evaporation from Nanoporous Silicon Membranes." https://doi.org/10.1109/ITHERM.2017.7992516

Outstanding Paper

  • Parida, P. R., A. Sridhar, A. Vega, M. D. Schultz, M. Gaynes, O. Ozsun, G. McVicker, T. Brunschwiler, A. Buyuktosunoglu, and T. Chainer. "Thermal Model for Embedded Two-Phase Liquid Cooled Microprocessor." https://doi.org/10.1109/ITHERM.2017.7992508

SYSTEM-LEVEL THERMAL MANAGEMENT

Best Paper

Outstanding Paper


MECHANICS & RELIABILITY

Best Paper

Outstanding Paper

  • Dudek, R., R. Döring, A. Otto, S. Rzepka, S. Stegmeier, S. Kiefl, A. Lunding, and R. Eisele. "FE Analyses and Power Cycling Tests on the Thermo-Mechanical Performance of Silver Sintered Power Semiconductors with Different Interconnection Technologies." https://doi.org/10.1109/ITHERM.2017.7992618

EMERGING TECHNOLOGIES & FUNDAMENTALS

Best Paper

Outstanding Paper


ITherm 2016


THERMAL MANAGEMENT

Best Paper

  • Brunschwiler, T., J. Zürcher, S. Zimmermann, B. R. Burg, G. Schlottig, Xi Chen, T. Sinha, et al. "Review of Percolating and Neck-Based Underfills with Thermal Conductivities up to 3 W/m-K." https://doi.org/10.1109/ITHERM.2016.7517541

Outstanding Paper


MECHANICS & RELIABILITY

Best Paper

Outstanding Paper


EMERGING TECHNOLOGIES & FUNDAMENTALS

Best Paper

  • Drummond, K. P., J. A. Weibel, S. V. Garimella, D. Back, D. B. Janes, M. D. Sinanis, and D. Peroulis. "Evaporative Intrachip Hotspot Cooling with a Hierarchical Manifold Microchannel Heat Sink Array." https://doi.org/10.1109/ITHERM.2016.7517565

Outstanding Paper

  • Chang, J. Y., T. Harirchian, S. Sahasrabudhe, S. Klein, F. Liang, Haowen Liu, M. Weng, et al. "Thermal-Mechanical Considerations during Thermal Solution Assembly of Bare-Die Packages." https://doi.org/10.1109/ITHERM.2016.7517536

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