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IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Prof. Avram Bar-Cohen ITherm Best Paper Awards



The IEEE ITherm Conference (sponsored by IEEE Electronics Packaging Society) is honored to announce the establishment of the Prof. Avram Bar-Cohen Best Papers of the Conference beginning with the 2021 Conference Year. There will be four such Awards, one for each Track of the Conference:

  1. Prof. Avram Bar-Cohen Best Paper in Component-Level Thermal Management
  2. Prof. Avram Bar-Cohen Best Paper in System-Level Thermal Management
  3. Prof. Avram Bar-Cohen Best Paper in Mechanics and Reliability
  4. Prof. Avram Bar-Cohen Best Paper in Emerging Technologies and Fundamentals

Each one of The Prof. Avram Bar-Cohen Best Paper Awards will have a $500 cash award distributed equally to all authors, with the funds coming from ITherm.

Prof. Avram Bar-Cohen, Distinguished University Professor in the Department of Mechanical Engineering, A. James Clark School of Engineering, University of Maryland, College Park, MD passed away on October 10, 2020. He was 74. Avi, as he is fondly known to all of us, was an eminent researcher in the science and art of heat transfer, particularly as it applies to cooling of electronic devices and systems. He was a guiding force in the emergence of thermal management of electronic devices and systems as a critical engineering domain

Since his passing, a lot has been written highlighting his accomplishments and contributions( IEEE EPS;ASME;University of Maryland)

Avi, in collaboration with his colleagues, showed great vision in starting the ITherm Conference series in 1988 as a companion conference to the broader IEEE Electronics Packaging Society's (at that time CHMT, later CPMT) flagship packaging conference, ECTC, by focusing ITherm on thermal and thermo-mechanical aspects of electronic devices and systems. Avi envisioned ITherm as a stand-alone conference to better serve the needs of researchers and engineers in these fields. The motivating factor was to maximize the program in thermal and thermo-mechanical aspects within ECTC. However, it became difficult to expand into additional thermal sessions because ECTC wanted room to focus on the new field of photonics packaging in 1987. To compensate, the thermal subcommittee of ECTC, with the help of Paul Wesling of Tandem Computers, who was CHMT's Publications VP, arranged for a fairly large meeting room on the top floor of the Rio Hotel, located about a mile (15-20 minutes walking distance) from ECTC venue, the day prior to that year's ECTC. There they conducted "rump sessions" for some of the papers that weren't accepted for presentation at ECTC. The "zeroth" ITherm was actually held in Las Vegas in 1987, at the Rio Hotel!! Following the ECTC reception that week, in the evening, Avi and Paul decided to take a long walk across the desert, away from the hotels on The Strip, to look up at the bright stars, discuss the meaning of life, and find alternatives for our profession. Paul remembers it well. Avi and Paul decided to help both ECTC and the thermal community with an inter-society solution involving IEEE's CHMT with ASME's Heat Transfer Division. Prof. G. P. "Bud" Peterson, of Texas A&M University, agreed to help develop the program. Those three headed up the planning and execution of the first ITherm in 1988, held in Los Angeles. That is Paul Wesling's best recollection on this Memorial Day 2021, just over 33 years to the day after our conference's initiation on May 11, 1988. Thereafter, ITherm was held in alternating years with ASME EPPD's InterPACK Conference, until it switched to its annual format in 2016. By co-locating with ECTC, the relevance and interconnectedness of ITherm's goals to the future packaging technologies have been demonstrated over the years. In the early years, Avi and his colleagues guided ITherm to become what it is today - a premier conference to exchange ideas, and report the latest advances in thermal management and thermo-mechanical aspects of electronic devices. He served twice as its General Chair, setting high goals and standards for the papers presented. These goals continue to last to-date and hopefully into the future. He encouraged ITherm leadership over the years to reach out to a wide range of audiences, from first-year graduate students to senior researchers, and to participants from all over the globe. Over the years, he mentored the conference leadership to adapt to continuous changes in technologies so that the conference remains relevant and current. He and his colleagues made sure to develop a capable leadership chain well into the future. He and his colleagues who started ITherm planted a sapling in 1988, which has emerged into a mature tree that provides a forum to discuss and disseminate the latest knowledge in the field.

We recall him joking at the 10th ITherm or so with several of us, with his ever present mischievous smile, that all of us would be attending the 25th ITherm with a walking stick, bent backs, with eye-glasses on the tips of our noses and asking "say what?!" with our hand cupped around our ear. In those days, ITherm was held once every two years and he was projecting to 2030 and beyond.

Naming the Best Papers of ITherm in his honor is a small token of the Community's appreciation, and to recognize what Avi created in 1988 with his colleagues and sustained over the years with his vision and leadership. We are all enjoying the fruits of his labor today and will continue to benefit for years to come. Thank you, Avi.

With best regards,
The ITherm Community

Awards Committee Chairs

Prof. Yogendra K. Joshi (Georgia Institute of Technology, USA), Committee Chair

Dr. Koneru Ramakrishna (Thermal Consultant, USA), Committee Co-Chair

Prof. Jeffrey Suhling, (Auburn University, USA), Committee Co-Chair

Selection Committee Members

Prof. Mehmet Arik (Özyeğin University, Turkey)

Prof. Mehdi Asheghi (Stanford University, USA)

Prof. Cemal Basaran (State University of New York, Buffalo, USA)

Prof. Sushil H. Bhavnani (Auburn University, USA)

Prof. Kuo-Ning Chiang (National Tsing Hua University, Taiwan

Dr. Victor A. Chiriac (Global Cooling Technology Group, LLC, USA)

Dr. M. Baris Dogruoz (Maxar Technologies Company, USA)

Prof. Abhijit Chandra (Iowa State University, USA)

Prof. Pradip Dutta (Indian Institute of Science, Bengaluru, India)

Prof. Joshua Gess (Oregon State University, USA

Dr. Przemyslaw J. Gromala (Robert Bosch GmbH, Germany)

Dr. Madhusudhan Iyengar (Google, USA)

Prof. Shi-Wei Ricky Lee (Hong Kong University of Science & Technology, Hong Kong)

Prof. Xiabing Luo (Huazhong University of Science and Technology, Wuhan, China)

Dr. Ravi Mahajan (Intel Corporation, USA)

Prof. Amy Marconnet (Purdue University, USA)

Prof. Tim Persoons (Trinity College, University of Dublin, Ireland)

Prof. Roger R. Schmidt (Syracuse University, USA)

Prof. Amir H. Shooshtari (University of Maryland, USA)

Dr. Kamak Sikka (IBM Corporation, USA)


ITherm 2020


COMPONENT-LEVEL THERMAL MANAGEMENT

Best Paper Award

  • Remco Van Erp, Georgios Kampitsis, Luca Nela, Reza Soleimanzadeh Ardebili, and Elison Matioli, "Embedded Microchannel Cooling for High Power-Density GaN-on-Si Power Integrated Circuits"

Outstanding Paper Award

  • David C. Deisenroth, Michael Ohadi, and Avram Bar-Cohen, "Heat Transfer and Two-Phase Flow Regimes in Manifold Microgaps: Performance Comparison Between R245fa and FC-27"

SYSTEM-LEVEL THERMAL MANAGEMENT

Best Paper Award

  • Jackson B. Marcinichen, Raffaele L. Amalfi , Filippo Cataldo, and John R. Thome, "General Thermosyphon Simulation Code for Electronics Cooling Applications"

Outstanding Paper Award

  • James Vangilder, Yatharth Vaishnani, Wei Tian, and Michael Condor, "A Compact Rack Model for Data Center CFD Modeling"

MECHANICS AND RELIABILITY TRACK

Best Paper Award

  • Stoyan Stoyanov, Chris Bailey, Rhys Waite, Christopher Hicks, and Terry Golding, "Modelling Indium Interconnects for Ultra Fine-Pitch Focal Plane Arrays"

Outstanding Paper Award

  • Pradeep Lall, Tony Thomas, and Ken Blecker, "RUL Estimations of SAC305 Solder PCB's under Different Conditions of Temperature and Vibration"

EMERGING TECHNOLOGIES AND FUNDAMENTALS TRACK

Best Paper Award

  • Darin J. Sharar, Adam A. Wilson, Asher Leff, Andrew Smith, K. Can Atil, Alaa Elwany, Raymundo Arroyave, and Ibrahim Karaman, "Additively Manufactured Nitinol as a Solid-State Phase Change Material"

Outstanding Paper Award

  • Farid Soroush, Ki Wook Jung, Mehdi Asheghi, Madhusudan Iyengar, and Chris Malone, "Mechanical Design and Reliability of Gold-Tin Eutectic Bonding for Silico-based Thermal Management Devices"

ITherm 2019


COMPONENT-LEVEL THERMAL MANAGEMENT

Best Paper

Outstanding Paper


SYSTEM-LEVEL THERMAL MANAGEMENT

Best Paper

  • Shurong Tian, Todd Takken, Mark Shultz, Chris Marroquin, Vic Mahaney, Yuan Yao, Michael J Ellsworth Jr, Anil Yuksel, and Paul Coteus, "A Single Flexible Cold Plate Cools Multiple Devices." https://doi.org/10.1109/ITHERM.2019.8757281

Outstanding Paper


MECHANICS & RELIABILITY

Best Paper

  • Rainer Dudek, Kerstin Kreyssig, Sven Rzepka, Michael Novak, Wolfgang Gruebl, Peter Fruehauf, and Andreas Weigert, "Comparisons of Solder Joints Fatigue Life Predictions and Several Long-Term Testing Results." https://doi.org/10.1109/ITHERM.2019.8757318

Outstanding Paper


EMERGING TECHNOLOGIES & FUNDAMENTALS

Best Paper

Outstanding Paper(Tie)

  • Martinus Arie, David Hymas, Farah Singer, Amir Shooshtari, and Michael Ohadi, "Performance Characterization of a Novel Cross-Media Composite Heat Exchanger for Air-to-Liquid Applications." https://doi.org/10.1109/ITHERM.2019.8757258
  • Aaditya Anand Candadai, Justin Weibel, and Amy Marconnet, "A Measurement Technique for Thermal Conductivity Characterization of Ultra- High Molecular Weight Polyethylene Yarns Using High-Resolution Infrared Microscopy." https://doi.org/10.1109/ITHERM.2019.8757385

ITherm 2018


COMPONENT-LEVEL THERMAL MANAGEMENT

Best Paper

Outstanding Paper

  • Thomas Germain, Tanvir A. Chowdhury, Jake Carter, and Shawn A. Putnam. "Measuring Heat Transfer Coefficients for Microchannel Jet Impingement Using Time-domain Thermoreflectance." https://doi.org/10.1109/ITHERM.2018.8419486

SYSTEM-LEVEL THERMAL MANAGEMENT

Best Paper

Outstanding Paper


MECHANICS & RELIABILITY

Best Paper

  • Bernhard Wunderle, Daniel May, Jens Heilmann, Joerg Arnold, Josef Hirscheider, Y. Li, Joerg Bauer, Mohamad Abo Ras "A Novel Concept for Accelerated Stress Testing of Thermal Greases and In-situ Observation of Thermal Contact Degradation." https://doi.org/10.1109/ITHERM.2018.8419568

Outstanding Paper


EMERGING TECHNOLOGIES & FUNDAMENTALS

Best Paper

  • Quang N. Pham, Shiwei Zhang, Lin Cheng-Hui, Shuai Hao, and Yoonjin Won "Boiling Heat Transfer Performance of Three-dimensionally Ordered Microporous Copper with Modulated Pore Diameters" https://doi.org/10.1109/ITHERM.2018.8419479

Outstanding Paper


ITherm 2017


COMPONENT-LEVEL THERMAL MANAGEMENT

Best Paper

  • Sircar, J. D., D. F. Hanks, Z. Lu, T. Salamon, K. R. Bagnall, S. Narayanan, D. Antao, B. Barabadi, and E. N. Wang. "High Heat Flux Evaporation from Nanoporous Silicon Membranes." https://doi.org/10.1109/ITHERM.2017.7992516

Outstanding Paper

  • Parida, P. R., A. Sridhar, A. Vega, M. D. Schultz, M. Gaynes, O. Ozsun, G. McVicker, T. Brunschwiler, A. Buyuktosunoglu, and T. Chainer. "Thermal Model for Embedded Two-Phase Liquid Cooled Microprocessor." https://doi.org/10.1109/ITHERM.2017.7992508

SYSTEM-LEVEL THERMAL MANAGEMENT

Best Paper

Outstanding Paper


MECHANICS & RELIABILITY

Best Paper

Outstanding Paper

  • Dudek, R., R. Döring, A. Otto, S. Rzepka, S. Stegmeier, S. Kiefl, A. Lunding, and R. Eisele. "FE Analyses and Power Cycling Tests on the Thermo-Mechanical Performance of Silver Sintered Power Semiconductors with Different Interconnection Technologies." https://doi.org/10.1109/ITHERM.2017.7992618

EMERGING TECHNOLOGIES & FUNDAMENTALS

Best Paper

Outstanding Paper


ITherm 2016


THERMAL MANAGEMENT

Best Paper

  • Brunschwiler, T., J. Zürcher, S. Zimmermann, B. R. Burg, G. Schlottig, Xi Chen, T. Sinha, et al. "Review of Percolating and Neck-Based Underfills with Thermal Conductivities up to 3 W/m-K." https://doi.org/10.1109/ITHERM.2016.7517541

Outstanding Paper


MECHANICS & RELIABILITY

Best Paper

Outstanding Paper


EMERGING TECHNOLOGIES & FUNDAMENTALS

Best Paper

  • Drummond, K. P., J. A. Weibel, S. V. Garimella, D. Back, D. B. Janes, M. D. Sinanis, and D. Peroulis. "Evaporative Intrachip Hotspot Cooling with a Hierarchical Manifold Microchannel Heat Sink Array." https://doi.org/10.1109/ITHERM.2016.7517565

Outstanding Paper

  • Chang, J. Y., T. Harirchian, S. Sahasrabudhe, S. Klein, F. Liang, Haowen Liu, M. Weng, et al. "Thermal-Mechanical Considerations during Thermal Solution Assembly of Bare-Die Packages." https://doi.org/10.1109/ITHERM.2016.7517536

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