IEEE Intersociety Thermal and Thermomechanical Conference

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IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Best Poster Awards

ITherm 2019


BEST OVERALL POSTER

  • "Effect of Surface Finish on The Fatigue Behavior of Bi-based Solder Joints" Sinan Su, Auburn University

COMPONENT-LEVEL THERMAL MANAGEMENT

Best Poster

  • "A Metamodeling Approach for Optimization of Manifold Microchannel Systems for High Flux Cooling Applications" Sevket Umut Yuruker, University of Maryland

Outstanding Poster

  • "Effect of Filler Configuration on the Effective Thermal Conductivity of Polymer Composites" Debraliz Isaac Aragones, Purdue University

SYSTEM-LEVEL THERMAL MANAGEMENT

Best Poster

  • "Heat Transfer And Pressure Drop Performance Of Additively Manufactured Plastic Heat Sinks For Low-Weight Directed Cooling Integration For Power Electronics" Reece Whitt, University of Arkansas

Outstanding Poster

  • "Two-Phase Cooling with Micropillar Evaporators: A New Approach to Remove Heat from Future High-Performance Chips" Zihao Yuan, Boston University

MECHANICS & RELIABILITY

Best Poster

  • "Investigation of Aging Induced Microstructural Changes in Doped SAC+X Solders" Jing Wu, Auburn University

Outstanding Poster

  • "Effect of Shallow Charging on Flexible Power Source Capacity Subjected to Varying C-Rates and Extreme Temperatures" Ved Soni, Auburn University

EMERGING TECHNOLOGIES & FUNDAMENTALS

Best Poster

  • "A Measurement Technique for Thermal Conductivity Characterization of Ultra-High Molecular Weight Polyethylene Yarns Using High-Resolution Infrared Microscopy" Aaditya Anand Candadai, Purdue University

Outstanding Poster

  • "Identifying Hot Spots in Electronics Packages with a Sensitivity-Coefficient Based Inverse Heat Conduction Method" Patrick Krane, Purdue University

ITherm 2018


BEST OVERALL POSTER

  • "Liquid Cooling Solutions for a High-frequency, Bi-directional, On-Board Electric Vehicle Power-hub", Kshitij Gupta, University of Toronto

COMPONENT-LEVEL THERMAL MANAGEMENT

Best Poster

  • "Identification of the Dominant Heat Transfer Mechanisms During Confined Two-Phase Jet Impingement" Matthew Clark, Purdue University

Outstanding Poster

  • "High Heat Flux Boiling Heat Transfer Through Nanoporous Membranes" Qingyang Wang, University of California, San Diego

SYSTEM-LEVEL THERMAL MANAGEMENT

Best Poster

  • "Electrical and Thermal Analysis of Vertical GaN-on-GaN P-N Diodes" Luke Yates, Georgia Institute of Technology

Outstanding Poster

  • "Artificial Neural Network Based Prediction of Temperature and Flow Profile in Data Centers" Jayati Athavale, Georgia Institute of Technology

MECHANICS & RELIABILITY

Best Poster

  • "Mechanical Characterization of Intermetallic Compounds in SAC Solder Joints at Elevated Temperatures" , Abdullah Fahim, Auburn University

Outstanding Poster

  • "Flexible Power-Source Survivability Assurance under Bending Loads and Operating Temperatures Representative of Stresses of Daily Motion" Amrit Abrol, Auburn University

EMERGING TECHNOLOGIES & FUNDAMENTALS

Best Poster

  • "Experimental Characterization of Microchannel Heat Sinks Made by Additive Manufacturing", Ivel Collins, Purdue University

Outstanding Poster

  • "Improving the Transient Thermal Characterization of GaN HEMTs" Georges Pavlidis . Georgia Institute of Technology

ITherm Partners

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