IEEE Intersociety Thermal and Thermomechanical Conference


IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Call for Abstracts

In addition to paper presentations and vendor exhibits, ITherm 2021 will have panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional development courses. Other activities include the Student Poster and Networking Session, Student Design Competition, and Art-in-Science Exhibition. Information will be made available as we approach the conference so please check back regularly.

Our abstract-submission website is now open, and we encourage your submissions through September 28, 2020. Review the details in our Call for Abstracts. To submit an abstract, please review the Author Instructions.

Original papers are solicited in the following general areas of interest (but not limited to):


  • 3D Packaging & Heterogeneous Integration
  • Package-Integrated Thermal Management
  • Embedded Cooling
  • Hotspot and Impingement Cooling
  • Thermal Interface Materials and Heat Spreaders
  • Thermoelectric and Peltier Devices
  • Heat Pipes, Vapor Chambers and Thermosyphons
  • Single / Two-Phase Cold Plates and Heat Sinks
  • RF and Power Electronics
  • LEDs, Photovoltaics, and Optoelectronics
  • Thermal Management of Electric Machines
  • Pulsed Power Dissipation


  • Air Cooling Techniques and Heat Exchangers
  • Liquid Cooling Solutions
  • Immersion Cooling and Refrigeration
  • Pumps, Compressors, Fans and Blowers
  • Phase Change Materials
  • Automotive, Batteries and Thermal Storage
  • Mobile and Internet of Things
  • Telecommunication Systems
  • Space and Aerospace
  • Data Center Thermal Management
  • Thermal Management in Electric Aircraft
  • Modeling of Complex Thermal Systems
  • Next-Gen Electronics Systems Co-Design


  • Boiling, Evaporation, and Condensation
  • Convection in Microchannels, Microgaps, and Jets
  • Pulsating / Oscillating and Non-Conventional Heat Pipes
  • Nanoscale and Transistor-Level Thermal Transport
  • Novel Materials and Fabrication Techniques
  • Measurement and Diagnostic Techniques
  • Numerical Methods, Nano-to-Macro Scale
  • Experimental Methods, Nano-to-Macro Scale
  • Prognostic Health Management and Reliability Analysis
  • Wearable, Flexible, and Printed Electronics
  • Additive Manufacturing
  • Silicon Fabrication for Thermal Management Devices
  • Predictive Analytics and Machine Learning


  • Thermo-Mechanical Modeling and Simulation
  • Mechanics and Reliability of Solder Joints and Interconnects
  • Materials Characterization, Processing, and Constitutive Models
  • Failure Mechanics, Fatigue, and Damage Modeling
  • Measurement of Deformations, Strains and Stresses
  • Shock, Drop and Vibrational Analysis
  • TSV / 3D Reliability and Packaging
  • Mechanics in Assembly and Manufacturing
  • Applied Reliability and Failure Analysis
  • Process-Structure-Property Relations / Multi-Scale Analyses
  • Accelerated Stress Testing and Modeling
  • Lifetime Prognostics and Condition Monitoring

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