IEEE Intersociety Thermal and Thermomechanical Conference

logo

IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

2021 PROFESSIONAL DEVELOPMENT COURSES


A set of 14 Professional Development Courses (PDCs) are being offered as a collaboration between ITherm and ECTC conferences. Each of these courses are presented by world-class experts, enabling participants to broaden their technical knowledge base. Each course will be 2.5 hours long and will occur within the 1st two weeks of the conference. New for 2021, attendees can register for more than two PDCs.

A separate registration fee is required to attend these courses, and the PDC course registration can be performed at the ECTC registration website : https://www.ectc.net/registration/


The courses include:
1. ACHIEVING HIGH RELIABILITY OF LEAD-FREE SOLDER JOINTS - MATERIALS CONSIDERATIONS
Course Leader: Ning-Cheng Lee - Indium Corporation

2. FUNDAMENTALS OF GLASS TECHNOLOGY AND APPLICATIONS FOR ADVANCED SEMICONDUCTOR PACKAGING
Course Leaders: Prakash Gajendra and Joseph Canale - Corning, Inc.

3. FUNDAMENTALS OF RF DESIGN AND FABRICATION PROCESSES OF FAN-OUT WAFER/PANEL LEVEL PACKAGES AND INTERPOSERS
Course Leaders: Ivan Ndip and Markus Wöhrmann - Fraunhofer IZM

4. ELIMINATING PACKAGE FAILURE MECHANISMS FOR IMPROVED RELIABILITY
Course Leader: Darvin Edwards -Edwards Enterprises

5. CHARACTERIZATION OF ADVANCED EMCs FOR FO-WLP, HETEROGENEOUS INTEGRATION, AND AUTOMOTIVE ELECTRONICS
Course Leaders: Przemyslaw Gromala - Robert Bosch GmbH

6. RELIABLE INTEGRATED THERMAL PACKAGING FOR POWER ELECTRONICS
Course Leader: Patrick McCluskey - University of Maryland

7. FLIP CHIP TECHNOLOGIES
Course Leaders: Eric Perfecto -GLOBALFOUNDRIES and Shengmin Wen - Synaptics Inc.

8. WAFER-LEVEL CHIP-SCALE PACKAGING (WCSP) FUNDAMENTALS
Course Leader: Patrick Thompson - Texas Instruments, Inc.

9. ADDITIVE FLEXIBLE HYBRID ELECTRONICS - MANUFACTURING AND RELIABILITY
Course Leader: Pradeep Lall - Auburn University

10. FAN-OUT WAFER/PANEL LEVEL PACKAGING AND 3D CHIPLET HETEROGENEOUS INTEGRATION
Course Leader: John Lau - Unimicron Technology Corporation

11. POLYMERS IN WAFER LEVEL PACKAGING
Course Leader: Jeffrey Gotro - InnoCentrix, LLC

12. RELIABILITY MECHANICS AND MODELING FOR IC PACKAGING
Course Leaders: Ricky Lee - HKUST and Xuejun Fan - Lamar University

13. FROM WAFER TO PANEL LEVEL PACKAGING
Course Leaders: Tanja Braun and Michael Töpper - Fraunhofer IZM

14. THERMAL MANAGEMENT OF ELECTRONICS
Course Leader: Jaime Sanchez - Intel Corporation

ITherm Partners

Partners



footer