IEEE Intersociety Thermal and Thermomechanical Conference

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IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

2019 Professional Development Courses


A set of 18 Professional Development Courses (PDCs) are being offered as a collaboration between the co-located ITherm and ECTC Conferences. All PDC courses will be held on Tuesday, May 28, 2019, on the day before the start of the ITherm and ECTC conferences. Attendees receive 0.4 Continuing Education Units (CEUs) for each course attended. The costs for attending the PDC course are independent from the registration costs at ITherm or ECTC.

Please register for these courses on the ECTC website. Please note that it is not necessary to register for the ECTC Conference when registering for the PDC courses.

The courses include:

MORNING COURSES 8:00 AM - 12:00PM

1.ACHIEVING HIGH RELIABILITY OF LEAD-FREE SOLDER JOINTS - MATERIALS CONSIDERATIONS
Course Leader: Ning-Cheng Lee - Indium Corporation

2.INTRODUCTION TO FAN-OUT WAFER LEVEL PACKAGING
Course Leader: Beth Keser - Intel Corporation

3.FUNDAMENTALS OF GLASS TECHNOLOGY AND APPLICATIONS FOR ADVANCED SEMICONDUCTOR PACKAGING
Course Leader: Dr. Indrajit Dutta - Corning, Inc.

4.MOORE'S LAW FOR PACKAGING TO REPLACE MOORE'S LAW FOR ICS
Course Leader: Rao Tummala - Georgia Institute of Technology

5.POLYMERS AND NANOCOMPOSITES FOR ELECTRONIC AND PHOTONIC PACKAGING
Course Leaders: C. P. Wong - Georgia Institute of Technology; Daniel Lu - Henkel Corporation

6.FUNDAMENTALS OF RF DESIGN AND FABRICATION PROCESSES OF FAN-OUT WAFER/PANEL LEVEL PACKAGES AND INTERPOSERS
Course Leaders: Ivan Ndip and Markus Wohrmann - Fraunhofer IZM

7.SOLVING PACKAGE FAILURE MECHANISMS FOR IMPROVED RELIABILITY
Course Leader: Darvin Edwards - Edwards Enterprises

8.CHARACTERIZATION OF ADVANCED EMCs FOR FO-WLP, HETEROGENEOUS INTEGRATION, AND AUTOMOTIVE ELECTRONICS
Course Leaders: Przemyslaw Gromala - Robert Bosch GmbH; Bongtan Han - University of Maryland

9.INTEGRATED THERMAL PACKAGING AND RELIABILITY OF POWER ELECTRONICS
Course Leader: Patrick McCluskey - University of Maryland

Afternoon Courses 1:15 PM - 5:15 PM

10.FLIP CHIP TECHNOLOGIES
Course Leaders: Eric Perfecto - Independent Consultant; Shengmin Wen - Synaptics Inc.

11.WAFER-LEVEL CHIP-SCALE PACKAGING (WCSP) FUNDAMENTALS
Course Leader: Patrick Thompson -- Texas Instruments, Inc.

12.FLEXIBLE HYBRID TECHNOLOGIES - MANUFACTURING AND RELIABILITY
Course Leader: Pradeep Lall - Auburn University

13. FAN-OUT WAFER/PANEL LEVEL PACKAGING AND 3D IC HETEROGENEOUS INTEGRATION
Course Leader: John Lau - ASM Pacific Technology Ltd.

14.POLYMERS FOR WAFER LEVEL PACKAGING
Course Leader: Jeffrey Gotro - InnoCentrix, LLC

15.RELIABILITY MECHANICS AND MODELING FOR IC PACKAGING - THEORY, IMPLEMENTATION AND PRACTICES
Course Leaders: Ricky Lee -- HKUST and Xuejun Fan - Lamar University

16.ROBUST ELECTRONICS FOR AUTOMOTIVE APPLICATIONS INCLUDING AUTONOMOUS DRIVING Course Leaders: Matthias Petzold - Fraunhofer IZM, Mervi Paulasto-Krockel - Aalto University, and Klaus-Juergen Wolter - TU Dresden

17.FROM WAFER TO PANEL LEVEL PACKAGING
Course Leaders: Tanja Braun and Michael Topper - Fraunhofer IZM

18.ELECTRONICS COOLING TECHNOLOGIES FOR HANDHELD DEVICES, COMPUTING, AND HIGH-POWER ELECTRONICS
Course Leaders: William Maltz and Guy Wagner - Electronic Cooling Solutions



ITHERM Sponsors

Gold Sponsor

Intel

Silver Sponsor

Huawei Technologies Co.

Program Sponsors

ITherm Exhibitors

Exhibitors

ITherm Partners

Partners



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