IEEE Intersociety Thermal and Thermomechanical Conference


IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

EPS President's Panel Session

Tuesday, May 28, 2019, 7:45 p.m. - 9:15 p.m.

Avi Bar-Cohen

Avi Bar-Cohen
Karlheinz Bock

Karlheinz Bock

All ITherm attendees are invited to attend the EPS President's Panel, which explores the future path of packaging science and technology and proposes possible scenarios for 2025. Visions of future packaging technologies will be presented and discussed with invited experts in the field of electronics packaging. The authors of the best selected submissions of the EPS packaging technology vision conquest will also join the discussion panel The involvement of our young professionals will bring fresh perspectives and new ways of thinking. The intention of this panel is to identify significant future packaging technologies in order to best serve IEEE and the electronics community.

ITherm Partners