IEEE Intersociety Thermal and Thermomechanical Conference


IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

ITherm Executive Committee

We thank the hard-working members of the ITherm Executive Committee!

The ExCom for the 2022 ITherm:

Prof. Dereje Agonafer
University of Texas at Arlington, USA
Prof. Cristina H. Amon
University of Toronto, CAN
Prof. Mehdi Asheghi
Stanford University, USA
Prof. Avram Bar-Cohen
University of Maryland and DARPA, USA
Prof. Sushil H. Bhavnani
Auburn University, USA
Prof. Yogendra K. Joshi
Georgia Institute of Technology, USA
Dr. Gary B. Kromann
Freescale Semiconductor, Inc., Austin, TX, USA
Prof. Alfonso Ortega
Villanova University, USA
Dr. Koneru Ramakrishna
Thermal Consultant
Prof. Baghat Sammakia
State University of New York at Binghamton, USA
Dr. Tom Lee
Dr. Sandeep Tonapi
Anveshak Technology and Knowledge Solutions, USA
Dr. Madhu Iyengar
Google, USA
Prof. Michael Ohadi
University of Maryland
Dr. Thomas Brunschwiler
IBM Research - Zurich
Prof. Jeffrey Suhling
Auburn University
Dr. Vadim Gektin
Justin Weibel
Purdue University

The Executive Committee is made up mostly of past ITherm General Chairs who are willing to assist the conference. It provides the continuity needed to carry forward the thrust of our InterSociety Conference.

Past ITherm General Chairs

1988 Avram Bar-Cohen
1990 Avram Bar-Cohen
1992 Sevgin Oktay
1994 Alfonso Ortega
1996 Dereje Agonafer
1998 Sushil H. Bhavnani
2000 Gary Kromann
2002 Cristina H. Amon
2004 Koneru Ramakrishna
2006 Bahgat Sammakia
2008 Tom Lee
2010 Yogendra K. Joshi
2012 Sandeep Tonapi
2014 Mehdi Asheghi
2016 Madhu Iyengar
2017 Michael Ohadi
2018 Thomas Brunschwiler
2019 Jeffrey Suhling
2020 Vadim Gektin
2021 Justin Weibel