IEEE Intersociety Thermal and Thermomechanical Conference

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IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Heterogneneous Integration Roadmap (HIR)
All-Day Workshop


Tuesday, May 28, 2019, 8:00 a.m. - 5:30 p.m.

Bill Chen

Bill Chen
ASE
Bill Bottoms

Bill Bottoms
3MT Solutions
Ravi Mahajan

Ravi Mahajan
Intel

All ITherm attendees are invited to attend the Heterogeneous Integration Roadmap (HIR) all-day workshop. This workshop is an important working session for our profession and for our industry, and attendance is complimentary and open to all ITherm and ECTC attendees. Heterogeneous Integration refers to the integration of separately manufactured components into a higher-level assembly that, in the aggregate, provides enhanced functionality and improved operating characteristics. In this definition components should be taken to mean any unit whether individual die, MEMS device, passive component and assembled package or sub-system that are integrated into a single package. The operating characteristics should also be taken in its broadest meaning including characteristics such as system level performance and cost of ownership.


Our industry has reinvented itself through multiple disruptive changes in technologies, products, and markets. Our industry continues to change with the rapid migration of logic, memory, and applications to the cloud, the evolution of the Internet of Things (IoT) to the Internet of Everything (IoE), the proliferation of smart devices everywhere, the rise of 5G, the increasing presence of microelectronics in wearables & health application, and in autonomous automotive, and the rapid advancement of AI. The pace of innovation is simultaneously increasing to meet these challenges. The Heterogeneous Integration Roadmap will address the future directions of heterogeneous integration technologies and applications serving the future markets and applications.


The mission of this Heterogeneous Integration Roadmap is to provide guidance to the profession, industry, academia and government to identify key technical challenges with sufficient lead time that they do not become roadblocks preventing the continued progress in electronics. That progress is essential to the future growth of the industry and the realization of the promise of continued positive impact on mankind. The approach is to identify the requirements for heterogeneous integration in the electronics industry through 2031, determine the difficult challenges that must be overcome to meet these requirements and, where possible, identify potential solutions. The Heterogeneous Integration Technology Roadmap is sponsored by the IEEE EPS Society, IEEE Electron Devices Society (EDS), and IEEE Photonics Society, together with SEMI and ASME EPPD.

For more information, please visit: https://eps.ieee.org/technology/heterogeneous-integration-roadmap.html


ITHERM Sponsors

Gold Sponsor

Intel

Silver Sponsor

Huawei Technologies Co.

Program Sponsors

ITherm Exhibitors

Exhibitors

ITherm Partners

Partners



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