IEEE Intersociety Thermal and Thermomechanical Conference


IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Heterogeneous Integration Roadmap Virtual WORKSHOP
Recording Available July 21st - Aug 19th

The Heterogeneous Integration Roadmap (HIR), released October 2019, is a roadmap to the future of electronics, identifying technology requirements and potential solutions. The primary objective is to stimulate pre-competitive collaboration between industry, academia and government to accelerate progress. The roadmap offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of technology over the next 15 years. The HIR also delivers a 25-year projection for heterogeneous integration of Emerging Research Devices and Emerging Research Materials with longer research-and-development timelines. With the release of the 2019 HIR edition, the preparation of the 2020 edition is well underway.

All ITherm 2020 Virtual registrants will have access to the recording of the HIR Workshop held as part of the 70th ECTC Virtual Event. This HIR workshop will feature speakers from all 22 chapters in 4 separate sessions together with an HIR overview presentation. They will describe their work in HIR 2019 and their focus for HIR 2020. The purpose of the HIR workshop is to broaden the proliferation of the roadmap content to the virtual ITherm 2020 Virtual participants for dialogue and feedback for inclusion into the 2020 edition.

Bill Chen

Bill Chen
Bill Bottoms

Bill Bottoms
Amr Helmy

Amr Helmy
Ravi Mahajan

Ravi Mahajan
Tom Salmon

Tom Salmon

  • HIR Overview:

    William (Bill) Chen and WR (Bill) Bottoms

  • HI for Communication

    Moderator: Amr Helmy, Univ of Toronto

  • HI for Consumer & Industrial Applications

    Moderator: Ravi Mahajan, ASME EPPD & Intel

  • HI for High Performance Computing

    Moderator: Bill Bottoms, IEEE EPS and 3MTS

  • HI for Special Applications

    Moderator: Tom Salmon, SEMI

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