IEEE Intersociety Thermal and Thermomechanical Conference

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IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

HIR plans on holding a workshop on May 31st from 8:00 - 5:00 in the Pacific Jewel C room of the Sheraton.


The tentative agenda is as follows:


08:00 am - 09:00 am Heterogeneous Integration Workshop: HIR Overview & 23 Chapter Updates
09:00 am - 10:30 am Future Networks & Beyond Panel Organizer - Tim Lee
10:30 am - 12:00 pm HIR Selected Topics Panel Organizer - Amr Helmy
12:00 pm - 01:30 pm Packaging for Supercomputing Panel Organizer - Kanad Ghose
01:30 pm - 03:00 pm Next Gen Pkg Challenges Panel Organizer - Jan Vardaman
03:00 pm - 04:30 pm Automotive Heterogeneous Int Panel Organizer - Vikas Gupta
04:30 pm - 05:00 pm Wrap-up

Register for the workshop at https://www.ectc.net/registration/eRegistrationHIR/input.cfm (no additional cost)



  • HIR Overview:

    William (Bill) Chen and WR (Bill) Bottoms

  • HI for Communication

    Moderator: Amr Helmy, Univ of Toronto

  • HI for Consumer & Industrial Applications

    Moderator: Ravi Mahajan, ASME EPPD & Intel

  • HI for High Performance Computing

    Moderator: Bill Bottoms, IEEE EPS and 3MTS

  • HI for Special Applications

    Moderator: Tom Salmon, SEMI




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