
08:00 am - 09:00 am | Heterogeneous Integration Workshop: | HIR Overview & 23 Chapter Updates |
09:00 am - 10:30 am | Future Networks & Beyond | Panel Organizer - Tim Lee |
10:30 am - 12:00 pm | HIR Selected Topics | Panel Organizer - Amr Helmy |
12:00 pm - 01:30 pm | Packaging for Supercomputing | Panel Organizer - Kanad Ghose |
01:30 pm - 03:00 pm | Next Gen Pkg Challenges | Panel Organizer - Jan Vardaman |
03:00 pm - 04:30 pm | Automotive Heterogeneous Int | Panel Organizer - Vikas Gupta |
04:30 pm - 05:00 pm | Wrap-up |
Register for the workshop at https://www.ectc.net/registration/eRegistrationHIR/input.cfm (no additional cost)
William (Bill) Chen and WR (Bill) Bottoms
Moderator: Amr Helmy, Univ of Toronto
Moderator: Ravi Mahajan, ASME EPPD & Intel
Moderator: Bill Bottoms, IEEE EPS and 3MTS
Moderator: Tom Salmon, SEMI