Sponsored by the IEEE's Electronics Packaging Society (EPS), ITherm 2021 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.
ITherm 2021 will be held virtually. In addition to paper presentations and vendor exhibits, ITherm 2021 will include, keynote lectures by prominent speakers, invited technology talks, networking opportunities and a student design competition.
All papers will be peer reviewed and published in the ITherm proceedings.
We invite you to submit an abstract for ITherm 2021!
|Deadline for Abstracts|
|Notification of Acceptance|
|Draft Paper Submission|
|Reviews Returned||February 15, 2021|
|Final Paper Submission||March 8, 2021|
|Author Registration Deadline||April 5, 2021|
|ITherm Conference Begins||June 1, 2021|
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