IEEE ITherm Conference
The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Sponsored by the IEEE's Electronics Packaging Society (EPS), ITherm 2020 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.
ITherm 2020 will be held along with the 70th Electronic Components and Technology Conference (ECTC 2020 - http://www.ectc.net), a premier electronics packaging conference at Walt Disney World Swan & Dolphin Hotel, FL, USA. Joint registrations will be available at a discounted rate. In addition to paper presentations and vendor exhibits, ITherm 2020 will include panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional short courses.
All papers will be peer reviewed and published in the ITherm proceedings. Student first authors will have the opportunity to apply for ITherm travel grants in order to make an oral presentation and participate in a Student Poster and Networking Session.
| Draft Paper Submission | December 16, 2019 |
| Reviews Returned | February 3, 2019 |
| Final Paper Submission | March 2, 2020 |
| Author Registration Deadline | March 30, 2020 |
| ITherm Conference Begins | May 26, 2020 |
To receive periodic announcements about ITHERM, please join our IEEE ListServ Dlist. You may also join by email: listserv@listserv.ieee.org with this information in the BODY: subscribe ieee-itherm FirstName LastName.
