IEEE Intersociety Thermal and Thermomechanical Conference


IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Welcome to ITherm 2021
The Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems

June 1 - June 4, 2021

Sheraton Hotel & Marina San Diego, CA USA

(Co-Located with ECTC)

Sponsored by the IEEE's Electronics Packaging Society (EPS), ITherm 2021 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.

ITherm 2021 will be held at the Sheraton Hotel & Marina, San Diego, CA, USA. In addition to paper presentations and vendor exhibits, ITherm 2021 will include panel discussions, keynote lectures by prominent speakers, panel discussions, invited technology talks, networking events and a student design competition.

All papers will be peer reviewed and published in the ITherm proceedings. Student first authors will have the opportunity to apply for ITherm travel grants in order to make an oral presentation and participate in a Student Poster and Networking Session.

We invite you to submit an abstract for ITherm 2021!

Note on on-going COVID-19 Pandemic:

  • We are closely monitoring the situation and working closely with IEEE and the Sheraton San Diego Hotel to ensure a safe and successful ITherm 2021 event
  • Any major changes in the conference format will announced before authors are required to registered and sign copyright
  • The conference start date will remain June 1st
  • We are planning virtual accommodations for authors and attendees who may be restricted from traveling to a physical event

Important Dates:

Deadline for Abstracts October 12, 2020
Notification of Acceptance October 26, 2020
Draft Paper Submission December 21, 2020
Reviews Returned February 8, 2021
Final Paper Submission March 8, 2021
Author Registration Deadline April 5, 2021
ITherm Conference Begins June 1, 2021

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