IEEE Intersociety Thermal and Thermomechanical Conference

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IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Welcome to ITherm 2020
The Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems

May 26 - May 29, 2020


Walt Disney World Swan & Dolphin Hotel, FL, USA

(Co-Located with ECTC)

Sponsored by the IEEE's Electronics Packaging Society (EPS), ITherm 2020 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.

ITherm 2020 will be held along with the 70th Electronic Components and Technology Conference (ECTC 2020 - http://www.ectc.net), a premier electronics packaging conference at Walt Disney World Swan & Dolphin Hotel, FL, USA. Joint registrations will be available at a discounted rate. In addition to paper presentations and vendor exhibits, ITherm 2020 will include panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional short courses.

All papers will be peer reviewed and published in the ITherm proceedings. Student first authors will have the opportunity to apply for ITherm travel grants in order to make an oral presentation and participate in a Student Poster and Networking Session.


Important Dates:

Draft Paper Submission December 16, 2019
Reviews Returned February 3, 2019
Final Paper Submission March 2, 2020
Author Registration Deadline March 30, 2020
ITherm Conference Begins May 26, 2020

Connect with ITherm:

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ITherm Exhibitors

Exhibitors


Staubli


CoolIT

ITherm Partners

Partners



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