Sponsored by the IEEE's Electronics Packaging Society (EPS), ITherm 2020 Virtual is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2020 Virtual Conference will be held July 21 - 23, 2020.
In addition to paper presentations and vendor exhibits, ITherm 2020 Virtual will include panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional short courses.
All papers will be peer reviewed and published in the ITherm proceedings.
The event will be brought to you using the ON24 virtual conference environment. In addition to accessing the conference proceedings, registered attendees can join us live each day of the conference from 12:00 PM - 4:00 PM Eastern Daylight Time (EDT) for one-time plenary events with options to interact with the presenters. In addition to these live viewing hours, ITherm attendees will be able to view recorded presentations for all of the technical paper sessions, as well as elevator pitches of the student posters, at their convenience for a period of 4 weeks after the conference opens. A summary of the ITherm 2020 Virtual conference events includes:
Recorded Content Available for Viewing
|Author Registration Deadline||June 8, 2020|
|Author's Presentation Upload Deadline||June 30, 2020|
|ITherm Conference Begins||July 21, 2020|
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