IEEE Intersociety Thermal and Thermomechanical Conference

logo

IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Welcome to ITherm 2021
The Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems

June 1 - June 4, 2021


Sponsored by the IEEE's Electronics Packaging Society (EPS), ITherm 2021 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.

ITherm 2021 will be held virtually. In addition to paper presentations and vendor exhibits, ITherm 2021 will include, keynote lectures by prominent speakers, invited technology talks, networking opportunities and a student design competition.

All papers will be peer reviewed and published in the ITherm proceedings.


We invite you to submit an abstract for ITherm 2021!



Important Dates:

Deadline for Abstracts October 12, 2020
Notification of Acceptance October 26, 2020
Draft Paper Submission January 11, 2021
Reviews Returned February 15, 2021
Final Paper Submission March 8, 2021
Author Registration and IEEE Copyright Deadline April 5, 2021
Author Presentation Upload April 26, 2021
ITherm Conference Begins June 1, 2021

Connect with ITherm:

To receive periodic announcements about ITherm, please join our IEEE ListServ Dlist. You may also join by email: listserv@listserv.ieee.org with this information in the BODY: subscribe ieee-itherm FirstName LastName.


Support/Help | IEEE Privacy & Opting Out of Cookies | Nondiscrimination Policy


ITherm Sponsors

Sponsors

ITherm Partners

Partners



footer