IEEE Intersociety Thermal and Thermomechanical Conference

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IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Welcome to ITherm 2022
The Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems

May 31 - June 3, 2022

Sheraton Hotel & Marina San Diego, CA USA

(Co-Located with ECTC)


Sponsored by the IEEE's Electronics Packaging Society (EPS), ITherm 2022 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.

ITherm 2022 will be held along with the 72nd Electronic Components and Technology Conference (ECTC 2022 - http://www.ectc.net), a premier electronics packaging conference at the Sheraton Hotel & Marina, San Diego, CA, USA. Joint registrations will be available at a discounted rate. In addition to paper presentations and vendor exhibits, ITherm 2022 will include panel discussions, keynote lectures by prominent speakers, panel discussions, invited technology talks, ECTC/ITherm joint networking events and short courses, an art-in-science exhibition, and a student design competition.

All papers will be peer reviewed and published in the ITherm proceedings. Student first authors will have the opportunity to apply for ITherm travel grants in order to make an oral presentation and participate in a Student Poster and Networking Session.


We invite you to submit an abstract for ITherm 2022!



Important Dates:

Deadline for Abstracts September 6, 2021
Notification of Acceptance October 10, 2021
Draft Paper Submission December 20, 2021
Reviews Returned February 7, 2022
Final Paper Submission March 7, 2022
Final Paper Notification March 21, 2022

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