IEEE Intersociety Thermal and Thermomechanical Conference


IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Welcome to ITherm 2020 Virtual
The Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems

Sponsored by the IEEE's Electronics Packaging Society (EPS), ITherm 2020 Virtual is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2020 Virtual Conference will be held July 21 - 23, 2020.

In addition to paper presentations and vendor exhibits, ITherm 2020 Virtual will include panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional short courses.

All papers will be peer reviewed and published in the ITherm proceedings.

The event will be brought to you using the ON24 virtual conference environment. In addition to accessing the conference proceedings, registered attendees can join us live each day of the conference from 12:00 PM - 4:00 PM Eastern Daylight Time (EDT) for one-time plenary events with options to interact with the presenters. In addition to these live viewing hours, ITherm attendees will be able to view recorded presentations for all of the technical paper sessions, as well as elevator pitches of the student posters, at their convenience for a period of 4 weeks after the conference opens. A summary of the ITherm 2020 Virtual conference events includes:

Live Events

  • Keynote Talks covering the areas of ethics in artificial intelligence, 3D system integration, and aerospace electrification thermal management
  • Technology Talk sessions providing deep dive talks on high profile topics
  • Student Heat Sink Design Challenge
  • Richard Chu ITherm Award for Excellence and Invited Presentation
  • Announcement of the ITherm 2020 Virtual Best Paper Awards

Recorded Content Available for Viewing

  • Access to technical papers and pre-recorded session presentations from all technical tracks
  • Student Posters with recorded elevator pitches showcasing the student's latest research
  • ECTC/ITherm Joint Diversity Panel
  • Heterogeneous Integration Roadmap (HIR) Workshop

Important Dates:

Author Registration Deadline June 8, 2020
Author's Presentation Upload Deadline June 30, 2020
ITherm Conference Begins July 21, 2020

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