Sponsored by the IEEE's Electronics Packaging Society (EPS), ITherm 2021 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.
ITherm 2021 will be held along with the 71st Electronic Components and Technology Conference (ECTC 2021 - http://www.ectc.net), a premier electronics packaging conference at the Sheraton Hotel & Marina, San Diego, CA, USA. Joint registrations will be available at a discounted rate. In addition to paper presentations and vendor exhibits, ITherm 2021 will include panel discussions, keynote lectures by prominent speakers, panel discussions, invited technology talks, ECTC/ITherm joint networking events and short courses, an art-in-science exhibition, and a student design competition.
All papers will be peer reviewed and published in the ITherm proceedings. Student first authors will have the opportunity to apply for ITherm travel grants in order to make an oral presentation and participate in a Student Poster and Networking Session.
We invite you to submit an abstract for ITherm 2021!
|Deadline for Abstracts||September 28, 2020|
|Notification of Acceptance||October 19, 2020|
|Draft Paper Submission||December 21, 2020|
|Reviews Returned||February 8, 2021|
|Final Paper Submission||March 8, 2021|
|Author Registration Deadline||April 5, 2021|
|ITherm Conference Begins||June 1, 2021|
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