Abstract: As advanced CMOS technology keeps scaling, monolithic large scale heterogeneous system-on-chip integration becomes ever more challenging, technically and economically. While individual functions for memory storage or logic still benefit significantly from CMOS scaling, the optimum implementation is diverging. A better solution can be realized by functionally partitioning the system into multiple smaller die ("chiplets") that can be realized using different, heterogenous technologies. High density 3D integration technologies are needed to recombine these chiplets, with minimal impact on the electronic circuit performance. Different 3D integration technologies can be applied at different levels of the 3D interconnect hierarchy, from the package to the die, to the wafer, to the standard cell and even to the transistor level, spanning an exponential scale in interconnect density.
The 3D integration solutions allow for the integration of ever larger systems. This also implies that power dissipation density increases and power delivery and heat removal become significant challenges. Hot spots become increasingly localized and time variable. This requires rethinking of the standard high performance cooling approaches.
To identify the correct choice and specifications for the 3D System integration approach, it is increasingly important to consider this during the earliest phases of system design. EDA tools are needed that enable the co-design of functionally partitioned heterogeneous systems in an "SOC" design style, including the power delivery and power removal systems.
Biography: Dr.ir. Eric Beyne obtained an MSc degree in Electrical Engineering in 1983 and the PhD in Applied Sciences in 1990, both from the University of Leuven (KU Leuven). Since 1986 he has been with imec in Leuven, Belgium. Currently, he is imec fellow, VP R&D and Director of imec's 3D System Integration program in which Imec's own staff works alongside engineers from 30+ industrial partners (IDMs, foundries, fabless semiconductor companies, OSATs as well as equipment, material, and software tool suppliers) This team performs R&D in the field of high-density interconnection and packaging techniques focused on "system-in-a-package" integration,3D-interconnections including through-silicon vias, micro-bumps, and copper pillars, wafer-level packaging, as well as research on packaging reliability including thermal and thermo-mechanical characterization. He is and has been an active member of the IEEE-EPS and IMAPS societies.He received the 2003 Microwave Prize from the IEEE Microwave Theory and Techniques Society, the 2016 European Semiconductor Award from Semi-Europe for his work on 3D technology and the 2019 W. D. Ashman-J.A.Wagnon Technical Achievement Award from IMAPS.
Abstract: As innovations in artificial intelligence, robotics, and other technology bring us virtual assistants, wearable health tech, autonomous vehicles, and more, many industries are transforming rapidly. While these new technologies have brought unimaginable benefits, they also are disrupting many industries and changing the structure of the workforce. The challenges and opportunities posed by AI are so great that calls are being made around the world for an ethical framework that would govern the development and use of AI, so that deployment of AI will be safe and beneficial for society as a whole.
Biography: Beena is an award winning senior executive with extensive global experience in Artificial Intelligence and digital transformation. She is the Founder and CEO of Humans For AI and AI Managing Director at Deloitte. Her knowledge spans across e-commerce, financial, marketing, telecom, retail, software products, services and industrial domains with companies such as HPE, GE, Thomson Reuters, British Telecom, Bank of America, e*trade and a number of Silicon Valley startups. She has co-authored the book "AI Transforming Business".
A well-recognised thought leader and keynote speaker in the industry, she also serves on the Industrial Advisory Board at Cal Poly College of Engineering and has been a Board Member and Advisor to several startups including Flerish, Predii, iguazio, CliniVantage and ProjectileX. Beena has been honored several times for her contribution to tech and her philanthropic efforts, including UC Berkeley 2018 Woman of the Year in Business Analytics, San Francisco Business Times' 2017 Most Influential Women in Bay Area, WITI's Women in Technology Hall of Fame, National Diversity Council's Top 50 Multicultural Leaders in Tech, CIO.com and Drexel University's Analytics 50 innovator, Forbes Top 8 Female Analytics Experts and Women Super Achiever Award from World Women's Leadership Congress. Beena thrives on envisioning and architecting how data, artificial intelligence and technology in general, can make our world a better, easier place to live.
Abstract: Aircraft electrification has been steadily progressing over the last 30 years, as the demand for electric power on aircraft continues to increase. The typical airliner class aircraft (> 120 passengers) now has ~ 180 kW of installed electric power capability, supplying standard electric loads, such as lighting, avionics and passenger services, and supplying limited subsystems' power demands such as hydraulic pumps, fuel pumps, and fans. Most of these loads are passively cooled with process fluid or ambient air. The electric generators are oil cooled at ~ 100 oC. The Boeing 787 ushered in a new era, with installed electric power of 1.5 MW. The increased capability meets the demands of a so called "More Electric Aircraft" (MEA) where subsystems traditionally powered either hydraulically or pneumatically are now powered electrically, most notably the aircraft environmental control system (ECS) and the wing anti-ice system. The ECS is supplied by +100 kW electric compressors and wing anti-ice is provided by electric resistive thermal blankets. The varying voltage and frequency requirements of these different loads, leads to the incorporation of ac-dc and dc-ac inverters for load power conditioning. These inverters generate a significant amount of heat at relatively low temperature. Now with the interest in propulsion electrification of airliner class aircraft, electric power demand could range between a few mega-watts up to +20 MW.
Propulsion electrification holds the promise of reducing aviation's carbon foot print, both by enabling access to green electric power and by reducing the power required for flight though distributed propulsion and propulsion airframe integration. Like the electric system of an MEA aircraft, the electric drive train (EDT) of an electrified propulsion system will require power electronics for propulsive load power conditioning. Even at efficiencies approaching 98%, these EDT components will reject a significant amount of low temperature heat (~ 25 to 50 oC).
This talk will discuss MEA background, describe the design space of possible electrified propulsion systems and aircraft, discuss the rationale and feasibility of various concepts, and highlight the thermal management challenges of electrified propulsion systems.
Biography: Mr. Lents has over thirty years of experience in the conceptual design of integrated aircraft primary and secondary power and thermal management systems. Mr. Lents is responsible for integrated aircraft systems, thermal management, and innovative propulsion systems technology development. He led the development of an integrated modeling environment for the study of integrated total aircraft power systems and their impact on air vehicle performance and led several studies investigating power and thermal management solutions for vehicles such as the JUCAS and future JSF derivatives. Currently, he is leading a NASA funded effort that developed the conceptual design of a single-aisle parallel hybrid propulsion system and is presently developing enabling technology for hybrid electric propulsion. He has experience in a diverse set of technical areas, including thermodynamics, fluid dynamics, turbo-machinery, heat transfer, power electronics cooling, systems integration and aircraft secondary power systems, reliability, risk/uncertainty analysis and life-cycle cost modeling. Mr. Lents received his B.S. in Mechanical Engineering from the University of Illinois and his M.S. in Mechanical Engineering from Purdue University.