Abstract: As advanced CMOS technology keeps scaling, monolithic large scale heterogeneous system-on-chip integration becomes ever more challenging, technically and economically. While individual functions for memory storage or logic still benefit significantly from CMOS scaling, the optimum implementation is diverging. A better solution can be realized by functionally partitioning the system into multiple smaller die ("chiplets") that can be realized using different, heterogenous technologies. High density 3D integration technologies are needed to recombine these chiplets, with minimal impact on the electronic circuit performance. Different 3D integration technologies can be applied at different levels of the 3D interconnect hierarchy, from the package to the die, to the wafer, to the standard cell and even to the transistor level, spanning an exponential scale in interconnect density.
The 3D integration solutions allow for the integration of ever larger systems. This also implies that power dissipation density increases and power delivery and heat removal become significant challenges. Hot spots become increasingly localized and time variable. This requires rethinking of the standard high performance cooling approaches.
To identify the correct choice and specifications for the 3D System integration approach, it is increasingly important to consider this during the earliest phases of system design. EDA tools are needed that enable the co-design of functionally partitioned heterogeneous systems in an "SOC" design style, including the power delivery and power removal systems.
Biography: Dr.ir. Eric Beyne obtained an MSc degree in Electrical Engineering in 1983 and the PhD in Applied Sciences in 1990, both from the University of Leuven (KU Leuven). Since 1986 he has been with imec in Leuven, Belgium. Currently, he is imec fellow, VP R&D and Director of imec's 3D System Integration program in which Imec's own staff works alongside engineers from 30+ industrial partners (IDMs, foundries, fabless semiconductor companies, OSATs as well as equipment, material, and software tool suppliers) This team performs R&D in the field of high-density interconnection and packaging techniques focused on "system-in-a-package" integration,3D-interconnections including through-silicon vias, micro-bumps, and copper pillars, wafer-level packaging, as well as research on packaging reliability including thermal and thermo-mechanical characterization. He is and has been an active member of the IEEE-EPS and IMAPS societies.He received the 2003 Microwave Prize from the IEEE Microwave Theory and Techniques Society, the 2016 European Semiconductor Award from Semi-Europe for his work on 3D technology and the 2019 W. D. Ashman-J.A.Wagnon Technical Achievement Award from IMAPS.
Abstract: As innovations in artificial intelligence, robotics, and other technology bring us virtual assistants, wearable health tech, autonomous vehicles, and more, many industries are transforming rapidly. While these new technologies have brought unimaginable benefits, they also are disrupting many industries and changing the structure of the workforce. The challenges and opportunities posed by AI are so great that calls are being made around the world for an ethical framework that would govern the development and use of AI, so that deployment of AI will be safe and beneficial for society as a whole.
Biography: Beena is an award winning senior executive with extensive global experience in Artificial Intelligence and digital transformation. She is the Founder and CEO of Humans For AI and AI Managing Director at Deloitte. Her knowledge spans across e-commerce, financial, marketing, telecom, retail, software products, services and industrial domains with companies such as HPE, GE, Thomson Reuters, British Telecom, Bank of America, e*trade and a number of Silicon Valley startups. She has co-authored the book "AI Transforming Business".
A well-recognised thought leader and keynote speaker in the industry, she also serves on the Industrial Advisory Board at Cal Poly College of Engineering and has been a Board Member and Advisor to several startups including Flerish, Predii, iguazio, CliniVantage and ProjectileX. Beena has been honored several times for her contribution to tech and her philanthropic efforts, including UC Berkeley 2018 Woman of the Year in Business Analytics, San Francisco Business Times' 2017 Most Influential Women in Bay Area, WITI's Women in Technology Hall of Fame, National Diversity Council's Top 50 Multicultural Leaders in Tech, CIO.com and Drexel University's Analytics 50 innovator, Forbes Top 8 Female Analytics Experts and Women Super Achiever Award from World Women's Leadership Congress. Beena thrives on envisioning and architecting how data, artificial intelligence and technology in general, can make our world a better, easier place to live.