IEEE ITherm Conference
The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Panel Session 1 : Tuesday, June 1, 11:45 AM - 12:45 PM EDT
Thermo/Mechanical Management of Advanced Mobile/Telecom, Wireless, and Computing Devices
Moderator: Victor A. Chiriac (Global Cooling Technology Group, LLC.)
Raj Pendse
Y. C. Lee
Kelvin Thermal Technologies,Inc.
Ravi Mahajan
Intel
John R. Thome
JJ Cooling Innovation
Amy Marconnet
Purdue University
Hiroyuki Ryoson
Dexerials Corp.
Ali Heydari
NVIDIA
Abstract: We are at the crossroads of the fourth industrial revolution, with the emergence of several technologies, including hyper-connectivity, advanced telecommunication avenues, Artificial Intelligence (AI), Internet of Things (IoT), cloud computing and big data. The society is changing at a fast pace, with connectivity and mobility driving every aspect of it: there were approximately 14 billion connected devices in 2015, and that number is expected to double by 2025. Everything requires higher performance, more data, faster processors! Heterogeneous Computing involves the central processing units (CPUs), the graphics processing units (GPUs), high speed interconnects and other elements that push forward the computing industry. The emergence of 5G will help power a significant rise in mobile communication, IoT technology, providing the infrastructure needed to carry huge amounts of data, allowing for a smarter and more connected world - enabling Smart Cities, connected roads, advanced transportation (Self-driving cars), AR/VR, AI robotics, Digital healthcare, smart Sports and many other. A panel of experts will share their vision on the future of small to large electronics thermal management and other advanced system level thermo-mechanical challenges and solutions of the future.
Panel Session 2 : Wednesday, June 2, 11:45 AM - 12:45 PM EDT
Model-Based Design of Novel Electronic Components and Systems - Challenges and Opportunities
Moderator: Przemyslaw Gromala (Bosch GmBH, Germany)
Pradeep Lall
Auburn University
Milena Vujosevic
TDK
Kashi Vishwanath Machani
Globalfoundries
Paola-Altieri-Weimar
Infineon Technologies AG
Sanket Karajgikar
Abstract: Model based design is a powerful methodology that allows accelerating design and development process of novel advanced packaging and electronic systems. Numerical tools allow combination of different domain as well as scale. Structure on integrated circuitry level as low as in (nm) scale, while at the same time novel communication or transportation system are measured in (cm) or (m). This panel will discuss challenges and opportunities that are ahead of us. We will share our experience and expertise from both industry (across entire supply chain) and academia.
Panel Session 3 : Thursday, June 3, 11:45 AM - 12:45 PM EDT
Two-Phase Liquid Cooling Systems for High-Power Electronics
Moderator: John Thome (GCTG LLC)
Filippo Cataldo
Metalmeccanica
Luca Amalfi
Nokia Bell Labs
Corey Wilson
ThermAvant Technologies
Mark Schultz
IBM
Matteo Bucci
MIT
Abstract: Thermosyphon and pulsating heat pipe cooling continues to gain traction in the cooling of electronics. The panel will address new developments on the industrialization of two-phase cooling systems. Panelists from diverse industrial sectors will cover the status of existing and pending applications for the designing of two-phase cold plates and their cooling systems (thermosyphon and PHP systems). Recent tests results from prototypes will also be presented.
Panel Session 4 : Thursday, June 3, 2:15 PM - 3:15 PM EDT
Thermal Challenges in Next-Generation Opto-Electronic Systems
Moderator: Luca Amalfi (Nokia Bell Labs), Amy Marconnet (Purdue)
Amr Helmy
University of Toronto
Mark Earnshaw
Nokia Bell Labs
Nitin Karwa
Honeywell
Yogendra Joshi
Georgia Institute of Technology
Peter de Bock
ARPA-E
Ying Sun
NSF
Abstract: Data transport, processing and storage are following an exponentially increasing trend, driven by higher demands in mobile broadband, video/gaming, cloud, 5G network and Internet of Things. Such escalating trends are directly linked to the next-generation "digital" transformation, which is dominated by intelligent machine-to-machine and human-to-machine communications, automating "everything everywhere". This has profound implications in terms of overall system design with the associated general trend towards achieving greater device functionality per unit volume. Optical fibers and photonic components are the preferred solution for both short-reach and long-haul communications. In order to meet next-generation bandwidth, latency and energy efficiency requirements, there is an ever-increasing need of closer integration and co-packing of optical and electronic components. Thermal management will be the key to enable these densification challenges by coupling novel passive cooling technologies with accurate temperature stabilization techniques. A panel of experts from industry, academia and government agencies will share their vision and discuss the importance of thermal management solutions for opto-electronic systems and beyond.
