IEEE Intersociety Thermal and Thermomechanical Conference

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IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

2022 Panel Sessions


THERMAL CHALLENGES IN NEXT-GENERATION SEMICONDUCTOR, CONSUMER ELECTRONICS AND DATA CENTER COOLING

Moderator: Mahsa Ebrahim (Loyola Marymount University) and Arjang Shahriari (Qualcomm)
Panelists: Taravat Khadivi (Meta), Timothy Fisher (UCLA), Cheng Chen (Meta), Alfonso Ortega (Villanova University), Yogendra Joshi (Georgia Institute of Technology)


ADVANCES IN TWO-PHASE COOLING OF ELECTRONICS

Moderator: John Thome (JJ Cooling Innovation SÓrl)
Panelists: Jackson Marcinichen (JJ Cooling Innovation), Scott Holland (Wieland Microcool), Peter de Bock (ARPA-E/DOE), Justin Weibel (Purdue University)


THERMAL CHALLENGES OF TRANSIENT LOADS FOR DEFENSE APPLICATIONS

Moderator: Mark Spector (Office of Naval Research)
Panelists: Todd Bandhauer (Colorado State University), Michael Fish (Army Research Lab), Patrick Shamberger (Texas A&M), Kevin McCarthy (PC Krause and Associates), Neera Jain (Purdue University)


THERMO-MECHANICAL RELIABILITY CHALLENGES IN POWER ELECTRONICS

Moderator: David Huitink (University of Arkansas) and Przemyslaw Gromala (Bosch)
Panelists: Yong Liu (OnSemi), Patrick McCluskey (University of Maryland), Karsten Meier (Technical University of Dresden), H. Alan Mantooth (University of Arkansas), David Geb (Ansys)


THERMAL, MECHANICAL AND ELECTRICAL PERFORMANCE CHALLENGES OF ADVANCED MOBILE/TELECOM/WIRELESS/HP COMPUTE AND IOT DEVICES

Moderator: Victor Chiriac (Global Cooling Technology Group, LLC)
Panelists: Raj Pendse (Facebook), Sam Graham (University of Maryland), John Thome (GCTG, LLC), Shlomo Novotny (ChillDyne), Ross Smith, RADX), Kinzy Jones (Magic Leap)



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