IEEE Intersociety Thermal and Thermomechanical Conference

logo

IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Call for Abstracts


In addition to paper presentations and vendor exhibits, ITherm 2019 will have panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional development courses. Other activities include the Student Poster and Networking Session and Art-in-Science Exhibition.

Our abstract submission website is now open, and we encourage your submissions through September 17, 2018. Review the details in our Call for Abstracts. Original papers are solicited in the following general areas of interest (but not limited to):

COMPONENT-LEVEL THERMAL MANAGEMENT
  • Transistor Technology
  • 2.5D / 3D Packaging
  • Embedded Cooling
  • Hotspot and Impingement Cooling
  • Thermal Interface Materials and Heat Spreaders
  • Thermoelectric and Peltier Devices
  • Heat Pipes, Vapor Chambers and Thermosyphons
  • Single / Two-phase Cold Plates and Heat Sinks
  • RF and Power Electronics
  • LEDs and Photovoltaics
  • Pulsed Power Dissipation
SYSTEM-LEVEL THERMAL MANAGEMENT
  • Air Cooling Techniques and Heat Exchangers
  • Liquid Cooling Solutions
  • Immersion Cooling and Refrigeration
  • Pumps, Compressors, Fans and Blowers
  • Phase Change Materials
  • Automotive, Batteries and Thermal Storage
  • Mobile and Internet of Things
  • Telecommunication Systems
  • Space and Aerospace
  • Data Center Thermal Management
EMERGING TECHNOLOGIES & FUNDAMENTALS
  • Convection in Microchannels, Microgaps & Jets
  • Pulsating / Oscillating and Non-Conventional HeatPipes
  • Thermal Transport in Nanotechnologies
  • Novel Materials and Fabrication Techniques
  • Measurement and Instrumentation Techniques
  • Numerical Methods, Nano-to-Macro Scale
  • Experimental Methods, Nano-to-Macro Scale
  • Prognostic Health Management and Reliability Analysis
  • Flexible Electronics
  • Additive Manufacturing
MECHANICS & RELIABILITY
  • Thermo-Mechanical Modeling and Simulation
  • Mechanics and Reliability of Solder Joints and Interconnects
  • Materials Characterization, Processing, and Constitutive Models
  • Failure Mechanics, Fatigue, and Damage Modeling
  • Measurement of Deformations, Strains and Stresses
  • Shock, Drop and Vibrational Analysis
  • TSV / 3D Reliability and Packaging
  • Mechanics in Assembly and Manufacturing
  • Applied Reliability andFailure Analysis
  • Process-Structure-Property Relations / Multi-Scale Analyses
  • Accelerated Stress Testing and Modeling
  • Lifetime Prognostics and Condition Monitoring


ITherm Partners



footer