IEEE Intersociety Thermal and Thermomechanical Conference
IEEE ITherm Conference
The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
ITherm Executive Committee
Richard Chu Award
Best Paper Awards
Best Poster Awards
Sponsors and Exhibitors
Professional Development Courses
Prior Conference Programs
Student Poster and Networking Session
Student Heat Sink Design Challenge
ASME/K16 and IEEE/EPS Student Design Challenge:
Expand the Possibilities of Heat Sink Design using Additive Manufacturing
Why design a conventional heat sink...
When you can flex your creativity with additive manufacturing?
Special thanks to our Platinum Sponsor
to be a
Future Technical Leader
in Additive Manufacturing!
Given performance requirements upon admission to the challenge, go from...
Finalists will defend their designs to technical leaders at the 2021 ITherm conference!
2018 Competition Finalists
2019 Competition Finalists
2020 Competition Finalists
White Paper Due
Send Models to GE
Organizational Committee Contact :
Registration Form :