IEEE Intersociety Thermal and Thermomechanical Conference
IEEE ITherm Conference
The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
Toggle navigation
Home
Committee
ITherm Executive Committee
2021 Committee
Awards
Richard Chu Award
Best Paper Awards
Best Poster Awards
Art-in-Science Awards
Sponsors and Exhibitors
Program
Professional Development Courses
Prior Conference Programs
Special Events
Student Poster and Networking Session
Student Heat Sink Design Challenge
Registration
Author Instructions
MyConferenceBuddy
ASME/K16 and IEEE/EPS Student Design Challenge:
Expand the Possibilities of Heat Sink Design using Additive Manufacturing
Why design a conventional heat sink...
When you can flex your creativity with additive manufacturing?
Special thanks to our Platinum Sponsor
GE wants
YOU
to be a
Future Technical Leader
in Additive Manufacturing!
Given performance requirements upon admission to the challenge, go from...
CONCEPT
REALITY
TEST
Finalists will defend their designs to technical leaders at the 2021 ITherm conference!
2018 Competition Finalists
2019 Competition Finalists
2020 Competition Finalists
Key Dates:
Application Period
Jan 18
th
-March 8
th
White Paper Due
March 8
th
Send Models to GE
March 22
nd
Finalists Notified
May 16
th
Details at
http://bit.ly/HSD2021
Organizational Committee Contact :
ASMEHeatSinkChallenge@gmail.com
Registration Form :
https://forms.gle/kzYuFk7UgxP3UDfu7
ITherm Sponsors
Sponsors
ITherm Partners
Partners
