IEEE Intersociety Thermal and Thermomechanical Conference

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IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

ASME/K16 and IEEE/EPS Student Design Challenge:

Calling on student teams to expand the possibilities of heat sink design using additive manufacturing! As part of this design challenge you will be asked to design, build, and validate an aluminum heat sink made with Additive Manufacturing techniques graciously made available to us by GE Additive. After this initial registration period, teams will be sent the scoring criteria and manufacturing constraints. You will have to prepare a white paper that justifies your design. This can be done with preliminary CFD/FEA modeling, empirical correlations, etc. The top white papers will be selected to print their part with GE Additive machines. Those heat sinks will then be sent for testing in order to determine the top designs. These top teams will be supported such that one member can travel to ITHERM where they will defend their design in front of industry leaders. From those oral presentations, the champion will be crowned! Good luck!

Timeline:

  • Design Phase & Heat Sink White Paper: October 6, 2021 - Feb 14, 2022
  • Semi-Finalist Teams - Coordinate with GE to Print Designs: Approximately Feb 14 - March 1, 2022
  • Finalist Teams Prepare to Present at ITHERM: Notified approximately May 15
  • ITHERM 2022: May 31 - June 3 2022


More information at: https://community.asme.org/htd_k_16_heat_transfer_electronic_equipment/w/wiki/16807.asme-k-16ieee-eps-heat-sink-challenge-2022.aspx




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