IEEE Intersociety Thermal and Thermomechanical Conference

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IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

ITherm 2020 Virtual Student Heat Sink Design Challenge


July 23, Thursday, 1:30 - 3:00 PM (Eastern)

The ITherm organizing committee is delighted to again host the joint ASME K-16 / IEEE EPS Student Design Challenge: "Expand the Possibilities of Heat Sink Design using Additive Manufacturing" during ITherm 2020 Virtual.

The Student Heat Sink Design Challenge is a team competition in which students design, analyze, and optimize an aluminum additively manufactured heat sink to cool a constant heat flux source subject to forced convection. Each year's competition offers a new flow configuration and performance metric. The design submitted from each student team, supported by their performance prediction, is evaluated based on a series of design and manufacturing criteria. The semi-finalist teams having the most effective and creative designs are granted the opportunity to have their designs fabricated using the additive manufacturing facilities at GE and performance tested at Oregon State University. The finalists are invited to present their designs to the ITherm community.

For the 2020 competition, designs were submitted by teams from around the world and evaluated by a team of experts. Six designs were selected as semi-finalists and had their designs successfully printed and tested experimentally. Each of the top teams will present their work at the 2020 ITherm Virtual Conference.


ASME/K-16 and IEEE/EPS Student Design Challenge Presented at ITherm 2019




2019 Finalists:

ASU 3D Devils, Purdue Heat Sink Makers,
Trinity College Dublin, and University of Maryland


2019 Winner:

Penn State Happy Valley


Special thanks to our Sponsor


ITherm Partners

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