IEEE Intersociety Thermal and Thermomechanical Conference

logo

IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

ASME/K16 and IEEE/EPS Student Design Challenge:

Expand the Possibilities of Heat Sink Design using Additive Manufacturing

Why design a conventional heat sink...

When you can flex your creativity with additive manufacturing?

Special thanks to our Platinum Sponsor

GE wantsYOU to be a Future Technical Leader in Additive Manufacturing!

Given performance requirements upon admission to the challenge, go from...

CONCEPT

REALITY

TEST

Finalists will defend their designs to technical leaders at the 2021 ITherm conference!

2018 Competition Finalists

2019 Competition Finalists

2020 Competition Finalists

Key Dates:
Application Period Jan 18th-March 8th White Paper Due March 8th
Send Models to GE March 22nd Finalists Notified May 16th
Details at

http://bit.ly/HSD2021

Organizational Committee Contact : ASMEHeatSinkChallenge@gmail.com

Registration Form : https://forms.gle/kzYuFk7UgxP3UDfu7

ITherm Partners

Partners



footer