IEEE ITherm Conference
The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
The ITherm organizing committee is delighted to announce the inaugural Student Heat Sink Design Challenge that will be held during ITherm 2019 (May 28th- May 31st, 2019; The Cosmopolitan of Las Vegas, Las Vegas, NV USA).
The Student Heat Sink Design Challenge is a team competition in which students will design, analyze and optimize an aluminum additively manufactured heat sink to cool a constant heat flux power electronics module subject to forced convection. The design from each student team is then evaluated based on a series of design and manufacturing criteria. The teams having the most effective and creative designs will have an opportunity to test their design using the additive manufacturing facilities at GE and using state-of-the-art test equipment at Oregon State University. Travel grants will be available to provide support for at least one member of each of the top teams to travel and present the team's work at the 2019 ITherm Conference in front of industry leaders.
Interested student teams should apply by February 25, 2019 using the application form found at the following link:
Heat Sink Design Competition Application Form
After applying, student teams will then have time to design a heat sink and prepare a 2 to 4-page white paper that justifies the design. The manufacturing and scoring constraints can be found at:
Heat Sink Design Competition Manufacturing and Scoring Constraints
The initial design assessment can be made using preliminary test results, modeling and/or empirical correlations. The white paper summarizing the design is due by March 18, 2019.
Any questions please contact us at:
ASMEHeatSinkChallenge@gmail.com
Submission and Selection Criteria:
Key Dates:
