IEEE Intersociety Thermal and Thermomechanical Conference


IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

2018 Tech Talk Sessions

Heterogeneous Integration/3D Chip Cooling

Explore the advanced in 3D packaging and heterogenous integration for both high power RF devices and silicon CMOS

Additive Manufacturing/Thermal Topology Optimization

Additive Technology has given the engineer of the future unparalleled design flexibility, these talks will explore in depth current state art and future vision thermal topology design optimization additive manufacturing technology

Next Generation Challenges in Numerical Modeling

Computational simulation of heat and fluid flow have become critical to the design and analysis of electronics cooling components and devices. This session will focus on both the refinement of existing methods, particularly with respect to incorporation of coupled, multi-physics phenomena and trustability established through verification, validation, and uncertainty quantification. The session will also address how new insights at atomistic length scales can be incorporated into predictive model tools at the device level.

Thermal Management in Aerospace/Automotive

Addresses emerging technologies and challenges for automotive and aerospace thermal management

Quantum and Crypto Computing Thermal and Energy Challenges

Crypto-Currency Mining and Quantum computing are "hot" emerging technologies posing new energy and thermal challenges. It has been estimated that Bitcoin mining energy consumption rivals that of a small nation, and that quantum computers are able to perform calculations beyond any capability seen before. Cooling these new technologies poses new challenges and opportunities for the thermal community. This session brings together experts in these fields who will share their perspectives on these challenges today and their vision of the future.

ITherm Partners