IEEE ITherm Conference
The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
THERMAL MANAGEMENT OF ELECTRIC MOTORS EMBEDDED ELECTRONICS FOR MOBILITY APPLICATIONS
Session Chair: Michael Ohadi (University of Maryland) and Peter De Bock (ARPA-E)
STACKED DIES THERMAL MANAGEMENT
Session Chair: Madhusudan Iyengar (Google), Weihua Tang (Intel Corporation)
RELIABILITY CHALLENGES IN EMERGING TECHNOLOGIES AND APPLICATIONS
Session Chair: Emre Armagan (Intel)
FUTURE OF DATA CENTER COOLING: WASTE HEAT REUSE AND RECOVERY AND SUSTAINABILITY
Session Chair: Dereje Agonafer (University of Texas at Arlington) and Bahgat G. Sammakia (Binghamton University)
THERMAL MANAGEMENT CHALLENGES IN WEARABLES
Session Chair: Naveenan Thiagarajan (GE Research, US)
