IEEE Intersociety Thermal and Thermomechanical Conference

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IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

2022 Tech Talk Sessions


THERMAL MANAGEMENT OF ELECTRIC MOTORS EMBEDDED ELECTRONICS FOR MOBILITY APPLICATIONS

Session Chair: Michael Ohadi (University of Maryland) and Peter De Bock (ARPA-E)


STACKED DIES THERMAL MANAGEMENT

Session Chair: Madhusudan Iyengar (Google), Weihua Tang (Intel Corporation)


RELIABILITY CHALLENGES IN EMERGING TECHNOLOGIES AND APPLICATIONS

Session Chair: Emre Armagan (Intel)


FUTURE OF DATA CENTER COOLING: WASTE HEAT REUSE AND RECOVERY AND SUSTAINABILITY

Session Chair: Dereje Agonafer (University of Texas at Arlington) and Bahgat G. Sammakia (Binghamton University)


THERMAL MANAGEMENT CHALLENGES IN WEARABLES

Session Chair: Naveenan Thiagarajan (GE Research, US)


 



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