IEEE Intersociety Thermal and Thermomechanical Conference

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IEEE ITherm Conference

The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

2020 Tech Talk Sessions


Tech Talk Session 1: Heterogeneous Integration

July 21, Tuesday, 3:00 - 4:00 PM (Eastern)


Efficient, Athermal, Photonics using Metal Optics

Speaker: Amr S. Helmy (University of Toronto); Y. Su, P. Chang and C. Lin

IEEE Heterogeneous Integration Roadmap initiative

Speaker: Bill Bottoms



Tech Talk Session 2: AI in Thermal Management

July 22, Wednesday, 1:30 - 2:30 PM (Eastern)


Lost in Space: Design Manifolds Can Accelerate Design and Optimization Iterations Several Fold

Speaker: Mark D. Fuge (University of Maryland)

Innovation in Heat Exchangers with Surrogate Modeling and Shape Optimization

Speaker: Vikrant Aute, Reinhard Radermacher (University of Maryland)



Tech Talk Session 3: Transient Thermal Management

July 22, Wednesday, 3:00 - 4:00 PM (Eastern)


Control Co-Design for Transient Thermal Management

Speaker: Neera Jain (Purdue)

Emerging Thermal Energy Storage Needs: High-power Electronic and Photonic Cooling

Speaker: Darin Sharar (US Army Research Laboratory)



ITherm Sponsors

Sponsors

UTA


GE

ITherm Exhibitors

Exhibitors


Staubli

ITherm Partners

Partners



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