Sponsored by the IEEE’s Electronics Packaging Society (EPS), ITherm 2024 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.
ITherm 2024 will be held along with the 74th Electronic Components and Technology Conference (ECTC 2024 – http://www.ectc.net), a premier electronics packaging conference at he Gaylord Rockies Resort & Convention Center in Denver, Colorado, USA. Joint registrations will be available at a discounted rate. In addition to paper presentations and vendor exhibits, ITherm 2024 will include panel discussions, keynote lectures by prominent speakers, invited technology talks, ECTC/ITherm joint networking events and short courses, and a student design competition.
All papers will be peer reviewed and published in the ITherm proceedings. Student first authors will have the opportunity to apply for ITherm travel grants in order to make an oral presentation and participate in a Student Poster and Networking Session.